DISCO develops, manufactures, and sells precision machines and precision processing tools.

Supports a wide range of applications
DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic. Support for blades of up to Φ5 inches is possible with user-specified specifications. In addition, the alignment function for multiple-mounted workpieces can also be added as an option.

DISCO

DAD3350

DAD321

Standard dual spindle dicing saw

Maximized throughput
The DFD6340 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30 % for step/bevel cut and 40 % for dual cut when compared with parallel dual spindle dicing saws.

DFD6340

2007
Developed the "DFL7340/7360" laser saws based on a business alliance with Hamamatsu Photonics

DFL7340

2002
300 mm-compatible Fully Automatic Laser Saw DFL7160 developed.

Supports various applications, including full cut and DAF cut
Φ300 mm    Ablation

DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to achieve non-thermal processing.
This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG.
Wafer contamination from laser processing particles can be prevented through installation of the HogoMax * coating/cleaning mechanism.
*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface

DFL7160

DFD641

DFD651

DCS141

2007
Developed the "DFD6362" dicing saw for 300 mm wafer processing.

Dicing saw for improved productivity with Φ300 mm wafers

Realizes further productivity improvement with various new functions
DFD6362 offers higher dual cut processing speed due to the shortened distance between the spindles. Enhanced axis mechanism improves the X-axis return speed and optimization of the parts used achieves higher speeds for the major transfer unit, resulting in a throughput improvement of approx. 7% compared to the previous model under the same conditions.

DFD6362

Enhanced dicing throughput
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.
DFD6361 offers highly consistent and dependable cut quality through
the new Synchro SpindleTM featuring superior radial rigidity. An
atomizing nozzle cleaning mechanism can also be installed in the
spinner unit as an option to effectively clean wafers after dicing

DFD6361

1993
DFD650 dual-spindle dicing saw developed.

DFD650

DAD341

EAD 6340

1992
DFD620 and DFD640 fully automatic dicing saws developed.

DFD640

A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.


Laser Saw






Discontinued Apr. 2019

DFL7020

2009
Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw.

Ultra compact dual-spindle automatic dicing saw

Small footprint
The optimal design of the DAD3650 combines high functionality and ultra compactness for a dual-spindle automatic dicing saw giving it a footprint 2/3 the size of the widely used single-spindle DAD3350 dicer for Φ8 inch wafers

DAD3650

DAD322

DAD521

2000
New series dicing saws, DFD6350 and DFD6360, and new series grinder, DFG8540, developed.

DFD6360

DAD695

DAD522

DAD-2H/6

DAD691

1992
DAD320 and DAD500 Series automatic dicing saws developed.

DAD320

1987
Fully Automatic Surface Grinder DFG-82IF/8 developed.

DFG-82IF/8

DTU151

Supports advancements for thinner wafers
Φ200 mm         2 axes, 3 chuck tables

Wafer Thinning
Thin grinding (100 µm)
Advanced handling systems and design features facilitate high yield for thin wafer grinding.

Design flexibility
The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions.

Inherited grinding specifications with an established reputation
DFG8540 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.2 t (28% less than DFG850) while maintaining the same basic specifications and performance level as the 800 series.

2000
New series dicing saws, DFD6350 and DFD6360, and new series grinder, DFG8540, developed.

DFG8540

Discontinued Apr. 1997
Up to 8inches wafer

DAD340

DTU152

Supports advancements for thinner and larger wafers
Φ300 mm               2 axes, 3 chuck tables              DBG            Wafer Thinning

Inherited grinding specifications with an established reputation
DFG8560 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. Equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.

Thin grinding (100 µm)
Advanced handling systems and design features facilitate high yield for thin wafer grinding.

Design flexibility
The DFG8560 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8160) for in-line processing solutions.




DFG8560

DAD641

DAD651

2003
Fully Automatic Grinder/Polisher DGP8760 and Fully Automatic Multi-Mounter DFM2700 (both machines 300 mm-compatible and designed for in-line configuration with each other) developed.

DGP8760

Spin cleaning and drying for workpieces processed using dicing saws

Manual cleaning system with enhanced cleaning performance
The DCS1441 is the optimal solution for cleaning and drying workpieces processed using a semi-automatic dicing saw or other equipment. High-pressure cleaning with a maximum discharge pressure of 11.8 Mpa and user-created cleaning sequences (settings for the cleaning arm swing speed and spinner rotation speed) offer the optimal cleaning operation for a wide range of workpieces. In addition, the rinse cleaning, atomizing cleaning nozzle, and high performance atomizing nozzle specifications can be installed as an option. The DCS1441 can greatly reduce the number of processing particles on a wafer

DCS1441

2003
8"-compatible Fully Automatic Dicing Saw DFD6240 developed.

Among the World’s Smallest Single Spindle Dicing Saws

Factory-friendly design
By optimizing the frame structure and handling section layout, the footprint is on par with that of DISCO’s semi-automatic unit (DAD3350), even though it is equipped with all the functions of a fully automatic unit (size reduced by about 20% from the DFD641). The equipment is designed to reduce energy and air consumption, contributing to lower operation costs and environmental impact. In addition, the condition monitor relays the processing status and key equipment information in real time for use in periodic inspections and process management.

DFD6240

Higher Dicing quality with lower environmental impact

Support for dicing quality
The DTU162 keeps both spindle cooling water and cutting water at a constant temperature and suitable pressure. It thereby helps manage expansion, contraction, and other undesirable phenomena caused by water temperature fluctuation.

DTU162

DFG841

DAD562

Fully-automatic surface planer for Φ8-inch wafers
Φ200 mm               1 axis, 1 chuck table            Planarization

Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.

DFS8910

DAL7020

DFG860

DFD681

Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser
Φ150 mm        Laser Lift-off

Laser Lift-off is a technology used to detach the material layer from the substrate by irradiating a laser on the material layer formed on the substrate.DFL7560L is a fully-automatic laser lift-off machine for Φ6-inch wafers which achieves high processing speed and high processing quality using a DPSS (solid state) laser.
Because processing is possible in a wide focal point range with optimum power using optics uniquely developed by DISCO, wafer damage and separation are reduced. Moreover, surface roughness after sapphire separation is extremely low.
Compared to general separation equipment using gas lasers, maintenance time is drastically reduced and processing quality is more stable.

DFL7560L

Next generation dicing engine featuring dual chuck tables for improved productivity
The DFD6750 is a dicing engine that provides significantly raised productivity. It also incorporates two chuck tables to enable one table to perform cutting while the other is simultaneously transferring, aligning, and cleaning. This results in a substantial reduction in spindle processing wait time for higher productivity. The return speed of each axis is also increased for improved throughput.

DFD6750

Discontinued 	Aug. 2000

Disco DFG840 and 841 Systems With two-spindle, two-chuck table specifications and a robot arm, the 840 and 841 machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble free handling. For safety, the DFG841 complies with the EC’s CE marking and is based on the SEMI S2-93.

DFG840

DAD681

DAD-2H/6T

2009
Introducing the DFL7161, Fully Automatic Laser Saw for 300 mm Wafers with Enhanced Basic Performance.

High-quality, high-throughput standard laser grooving model
Φ300 mm       Ablation

DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use.
It performs a series of processes from HogoMax* coating and dicing to automatic cleaning.
The HogoMax coating and cleaning sections are located separately to significantly reduce waiting time.

*A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface

DFL7161

DFD620

DFD660

DTU1531

Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces

High processability
Adoption of a 1.8 kW high-output spindle enables the processing of a wide range of materials from silicon to difficult-to-process materials like ceramics.

High maintainability
Built-in microscope with a lens shutter and scope blow function reduces maintenance frequency, which increases the utilization rate.

DAD3240

DAD520

DVC010

DTU1530

DFD691

DCS140

2008
Developed the "DDS2300" fully automatic die separator.

Improves the cut quality of thin wafers with DAF
In separation process for thin wafers with DAF (Die Attach Film), there are issues such as DAF burring forming on the cut surface when full-cut dicing is performed and pickup errors during die bonding. Using the DDS2300 in the dicing process improves DAF cut quality and provides solutions for these issues.

DDS2300

2004
6"-compatible automatic dicing saw DAD3220/3230/3430 and 8"-compatible fully automatic dicing saw DFD6450 developed.

Compact Dicing Saw for Φ6-inch Workpieces with Superior Expandability

Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification
Single-axis dicing saw which is compatible with the 6 x 6-inch workpiece using a user-specified specification.

Improved usability and performance
Each model features an LCD touch panel with a graphical user interface for easy and intuitive operation. In addition, all models include auto-alignment, auto-focus, and auto-kerf check functions for enhanced productivity. The newly developed 1.5 kW spindle, which is standard on every model, features a shaft lock function for easier blade changing. A reduced-expansion spindle (option) manufactured with special expansion-resistant materials is available for even greater precision during processing.

DAD3230

DFD-2S/8

DFL7260

2007
Developed the "DGP8761" grinder/polisher for 300 mm wafer processing and the "DFM2800" multi-wafer mounter.

DGP8761

DFG850

DFM2700

DAC552

DTU170	

DWT-13R II

DVC011	

DAD-2SP/6T

Dry polisher for Φ8-inch wafers with chemical free stress relief
Φ200 mm
1 axis, 1 chuck table
Wafer Thinning
Stress Releaf

DFP8140

EAD 6750

2004
6"-compatible automatic dicing saw DAD3220/3230/3430 and 8"-compatible fully automatic dicing saw DFD6450 developed.
Dicing Saw for 6 × 6-inch Workpieces Designed for Compactness

Compatible with 6 × 6-inch Workpieces Using a User-Specified Specification
Single-axis dicing saw which is compatible with the 6 x 6-inch workpiece using a user-specified specification.

Improved usability and performance
Each model features an LCD touch panel with a graphical user interface for easy and intuitive operation. In addition, all models include auto-alignment, auto-focus, and auto-kerf check functions for enhanced productivity. The newly developed 1.5 kW spindle, which is standard on every model, features a shaft lock function for easier blade changing. A reduced-expansion spindle (option) manufactured with special expansion-resistant materials is available for even greater precision during processing.

DAD3220

EAD 6361

DAD650

**PARTS**

DTU150

Evolved Compact Dicing Saw

Compatible with Diverse Small Workpiece Processing Needs
DAD3221 is a single-axis dicing saw which achieves processing of workpieces up to Φ6 inches as a standard, and 150 x 150 mm with a user-specified specification. Has the world’s smallest footprint* (width: 490 mm x depth: 870 mm) through the small footprint design. A 2.0 kW high-torque spindle is installed as a standard specification and a high-rotation 1.8 kW spindle is available as an option.
*Investigated by DISCO

High Productivity
Software operation speed and response speed are improved through adoption of a high performance MCU. The axis speed is accelerated and throughput is improved by adopting servo motors for all axes. In addition, this model uses PC electric components as standard and supports communication control as an option. Because image recognition functions, such as auto alignment, auto focus, auto kerf check, are installed as a standard specification, it is possible to minimize operator labor costs.

DAD3221

Automatic grinder to respond to new processing needs
Φ200 mm             1 axis, 1 chuck table

Simple and compact single-axis grinder
The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed to process a variety of materials.

Space-saving design
Machine dimensions: 600 (W) x 1,700 (D) x 1,780 (H) mm

Precision grinding
Adoption of high-rigidity, low-vibration spindle provides superior grinding results and is capable of in-feed grinding and creep feed grinding (user-specified specification).

Unlimited materials
Process hard or brittle substrates of various diameters with ease. The DAG810 is also the choice for processing a wide variety of electronic components.

DAG810

DFD-2HST

2011
Developed the DFG8830, a grinder with a 4-axis and 5-chuck table configuration for hard and brittle materials such as sapphire and SiC.

DFG8830

Reliable separation of small die wafers
The DDS2010 offers an integrated expansion and breaking solution to achieve high-yield and high-throughput die singulation of wafers processed using Stealth Dicing™ process (SD)※.

*Stealth Dicing™ is a processing method that focuses a laser within the workpiece to form a modified layer, after which a tape expander is used to separate the die. This processing method is effective in achieving street reduction for small die or rectangular-shaped die such as RFID ICs and line sensors.

DDS2010

Φ6-inch Compact Dicing Saw which Achieves World’s Smallest Footprint while Improving Functionality

Support for a variety of applications from semiconductor wafers to electronic parts
DAD324 is a single-axis dicing saw which is compatible with workpieces up to Φ6 inches with a 2.0 kW high-torque spindle. 150 x 150 mm workpieces can be processed using a user-specified specification.

DAD324

DAC-2SPH

DAD685

DAC550

Two high-speed (max. 60,000rpm), ultralow-vibration air spindles are provided. DISCO’s original blade know-how and ultralow-vibration, high-speed spindles work together to achieve high-quality dicing at high speed, for not only silicon wafers but also compound semiconductor
wafers.
The dual spindle configuration ensures improved throughput via dual dicing and enhanced quality via step and bevel cutting. 

DFD-2D/8

DFG871

DAD640

Adopted an air slide on the X-axis to support high precision processing needs
Φ150 mm          Single spindle


DAD3431

Stable High Precision Processing
DTU1550 is a water supply unit for dicing saws and grinders that provide a stable supply of spindle cooling water or dicing water at a constant temperature and suitable pressure. Due to optimizations in the unit design, changes in temperature when changing the flow rate of dicing water can be kept under 1ºC. Changes in dicing saws, grinder spindles, chuck tables, and workpiece areas around the process point due to changes in temperature can be minimized to help improve processing precision.

DTU1550

DAD-2H/5

DAC-4SP/126

DAD-2H/8

DFL7360

DAD381

Discontinued 	Nov. 1996
up to 12 in wafer

DAD380

2017
Developed DFL7362, a stealth dicing laser saw that achieves higher throughput.

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
Φ300 mm        Stealth Dicing™       SDBG       SDTT

DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers.
Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength.
The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.

DFL7362

DAC350

DAC351

CMP polisher designed to process hard-to-process materials such as sapphire and SiC
Φ200 mm                1 axis, 2 chuck tables                 Wafer Thinning               Stress Releaf

Fully automatic operation
The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically.

For small workpieces made of difficult-to-process materials
The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.

DISCO

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