DFG8540
Category
Wafer GrindingOverview
The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.
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DISCO
DFG8540
Wafer GrindingVintage: 2015Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG8540
Wafer GrindingVintage: 2007Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG8540
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG8540
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days ago
DISCO
DFG8540
Wafer GrindingVintage: Condition: UsedLast Verified15 days agoDISCO
DFG8540
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG8540
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG8540
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days ago