ENGIS

HVG-300

-18" variable speed table
-10HP variable speed grinding spindle motor
-Electromagnetic chuck with auto demag cycle which can be configured with custom workholding systems
-Thru-spindle vacuum/pressure feed
-Integral air mist collection and coolant flow systems for clean consistent grinding
-Programmable touch screen controls
-Manual handwheel for precise Z-axis positioning
-Internal memory for saving grind process recipes for quick changeovers
-Password protection and operator lock-out features
-Automatic routine maintenance reminders
-82" x 70" footprint

DCM TECH

IG 180 SD

A cylindrical grinding machine for medium-sized workpieces in individual and small batch production.

Studer is a market and technology leader in universal, external and internal cylindrical grinding as well as noncircular grinding

STUDER

The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.

DISCO develops, manufactures, and sells precision machines and precision processing tools.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

Wafer Grinding

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Manufacturers of Wafer Grinding

Top Products for Wafer Grinding

HVG-300

IG 180 SD

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DFG8540