DFG841
Category
Wafer GrindingOverview
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
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DISCO
DFG841
Wafer GrindingVintage: 2000Condition: Parts ToolLast Verified28 days agoDISCO
DFG841
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG841
Wafer GrindingVintage: 1998Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG841
Wafer GrindingVintage: 1998Condition: UsedLast VerifiedOver 60 days ago
DISCO
DFG841
Wafer GrindingVintage: Condition: UsedLast Verified30 days agoDISCO
DFG841
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG841
Wafer GrindingVintage: 2001Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG841
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days ago