Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.Documents
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DISCO
DFG841
Verified
CATEGORY
Wafer Grinding
Last Verified: 14 days ago
Key Item Details
Condition:
Parts Tool
Operational Status:
Unknown
Product ID:
111210
Wafer Sizes:
Unknown
Vintage:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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DISCO
DFG841
CATEGORY
Wafer Grinding
Last Verified: 14 days ago
Key Item Details
Condition:
Parts Tool
Operational Status:
Unknown
Product ID:
111210
Wafer Sizes:
Unknown
Vintage:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.Documents
No documents