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DISCO DFG841
  • DISCO DFG841
  • DISCO DFG841
  • DISCO DFG841
Description
No description
Configuration
No Configuration
OEM Model Description
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
Documents

No documents

PREFERRED
 
SELLER
verified-listing-icon

Verified

CATEGORY
Wafer Grinding

Last Verified: 13 days ago

Buyer pays 12% premium of final sale price
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

125536


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

DISCO

DFG841

verified-listing-icon
Verified
CATEGORY
Wafer Grinding
Last Verified: 13 days ago
listing-photo-b58e3a07f5fe4dcdb9c093cdf7ece9ff-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

125536


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
Documents

No documents