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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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DISCO DFG841
    Description
    No description
    Configuration
    FULL-AUTO
    OEM Model Description
    The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
    Documents

    No documents

    DISCO

    DFG841

    verified-listing-icon

    Verified

    CATEGORY
    Wafer Grinding

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    63113


    Wafer Sizes:

    4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm


    Vintage:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grinding
    Vintage: 2000Condition: Parts Tool
    Last Verified29 days ago

    DISCO

    DFG841

    verified-listing-icon
    Verified
    CATEGORY
    Wafer Grinding
    Last Verified: Over 60 days ago
    listing-photo-74465ec0ba7944308a724d107b79576a-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    63113


    Wafer Sizes:

    4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm


    Vintage:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    FULL-AUTO
    OEM Model Description
    The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
    Documents

    No documents

    Similar Listings
    View All
    DISCO DFG841

    DISCO

    DFG841

    Wafer GrindingVintage: 2000Condition: Parts ToolLast Verified:29 days ago
    DISCO DFG841

    DISCO

    DFG841

    Wafer GrindingVintage: 0Condition: UsedLast Verified:Over 60 days ago
    DISCO DFG841

    DISCO

    DFG841

    Wafer GrindingVintage: 1998Condition: UsedLast Verified:Over 60 days ago