DFG840
Category
Wafer GrindingOverview
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.
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DISCO
DFG840
Wafer GrindingVintage: 1995Condition: UsedLast Verified28 days agoDISCO
DFG840
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG840
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG840
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days ago
DISCO
DFG840
Wafer GrindingVintage: 1995Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG840
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG840
Wafer GrindingVintage: 1995Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG840
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days ago