DAG810
Category
Wafer GrindingOverview
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.
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DISCO
DAG810
Wafer GrindingVintage: Condition: RefurbishedLast VerifiedOver 60 days agoDISCO
DAG810
Wafer GrindingVintage: 2012Condition: UsedLast VerifiedOver 60 days agoDISCO
DAG810
Wafer GrindingVintage: 2017Condition: UsedLast VerifiedOver 60 days agoDISCO
DAG810
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 30 days ago
DISCO
DAG810
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoDISCO
DAG810
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoDISCO
DAG810
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoDISCO
DAG810
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days ago