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Description
Basic specifications: Workpiece diameter the machine can handle = Maximim 8" 4/5/6/8 when the universal check table is used. Workpiece thickness the machine can handle = Maximum 20 mm Grinding system = In-feed grinding by rotating workpiece Grinding wheel used = 20 mm (8'') diamond wheel Spindle section: Bearing type: Air bearing Number of axes: 1 Motor: 4.2 kw high-frequency motor Motor electric current: Displayed in real time on the monitor (with peak-hold function) Rotative speed: 1,000 to 7,000 min -1 Rotative speed command unit: 1 min -1Configuration
No ConfigurationOEM Model Description
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.Documents
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
110343
Wafer Sizes:
Unknown
Vintage:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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DISCO
DAG810
CATEGORY
Wafer Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
110343
Wafer Sizes:
Unknown
Vintage:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available