DFL7340
Category
Scribing, Cutting, DicingOverview
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
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23
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DISCO
DFL7340
Scribing, Cutting, DicingVintage: 2010Condition: UsedLast VerifiedOver 60 days agoDISCO
DFL7340
Scribing, Cutting, DicingVintage: 2012Condition: UsedLast VerifiedOver 30 days agoDISCO
DFL7340
Scribing, Cutting, DicingVintage: 2010Condition: UsedLast VerifiedOver 60 days agoDISCO
DFL7340
Scribing, Cutting, DicingVintage: 2010Condition: UsedLast VerifiedOver 60 days ago
DISCO
DFL7340
Scribing, Cutting, DicingVintage: 2018Condition: UsedLast VerifiedOver 60 days agoDISCO
DFL7340
Scribing, Cutting, DicingVintage: 2011Condition: UsedLast VerifiedOver 60 days agoDISCO
DFL7340
Scribing, Cutting, DicingVintage: 2011Condition: UsedLast VerifiedOver 60 days agoDISCO
DFL7340
Scribing, Cutting, DicingVintage: Condition: UsedLast VerifiedOver 30 days ago