The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.

DISCO develops, manufactures, and sells precision machines and precision processing tools.

DISCO

DFD6341

DISCO DFD6341.pdf

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DFD6341

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