Description
Working condition, No missingConfiguration
Software Ver. 2.50 Spindle Torque: l.8kW Chuck Table: <1>230 Porous Spinner Table: 8 inch Porous Transport section Ionizer: None Blade attachment: With Fla11ge Spinner cleaning Nozzle: 2-Fluid Nozzle UV mechanism: None Recognition Ca1nera: CCD Utility: ITEM SPECIFICATION POWER 3WIRE+GROUND Cutting WATER RC3/8 AIR RCl/4 COOLING WATER(IN) RCl/4 COOLING WATER(OUT) RCl/4 EXHAUST DUCT ¢ 101.6mm DRAINAGE DUCT ¢50.6mmOEM Model Description
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.Documents
DISCO
DFD6341
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
108440
Wafer Sizes:
8"/200mm
Vintage:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFD6341
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
108440
Wafer Sizes:
8"/200mm
Vintage:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available