Description

No description

Configuration

Process: Wafer Dicing Mode: Fully-auto

OEM Model Description

The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.

Documents

No documents

DISCO

DFD6341

Verified

Scribing, Cutting, Dicing

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

116461

Wafer Sizes:

4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm

Vintage:

2017

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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