Description
No descriptionConfiguration
Process: Wafer Dicing Mode: Fully-autoOEM Model Description
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.Documents
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DISCO
DFD6341
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116461
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFD6341
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116461
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Process: Wafer Dicing Mode: Fully-autoOEM Model Description
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.Documents
No documents