Description

Working condition, No missing

Configuration

Software Ver. 2.50 Spindle Torque: l .8kW Chuck Table: None Spinner Table: 8 inch Porous Transport section Ionizer: None Blade attachment: No Flange Spinner cleaning Nozzle: 2-Fluid Nozzle UV mechanism: None Recognition Camera: CCD Utility: ITEM SPECIFICATION POWER 3WIRE+GROUND CUTTING WATER RC3/8 􀀪IR RC1/4 COOLING WATER(IN) RC1/4 COOLING WATER(OUT) RC1/4 EXHAUST DUCT ¢ 101.6mm DRAINAGE DUCT ¢ 50.6mm

OEM Model Description

The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.

Documents

DISCO DFD6341.pdf

DISCO

DFD6341

Verified

Scribing, Cutting, Dicing

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used

Operational Status:

Deinstalled

Product ID:

108439

Wafer Sizes:

8"/200mm

Vintage:

2017

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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