Description
DicingConfiguration
-Software Ver.2.50 -Spindle Torque: 1.8kW -Chuck Table: Φ200 Porous -Spinner Table: 8 inch Porous -Transport section Ionizer: None -Blade attachment: With Flange -Spinner cleaning Nozzle: 2-Fluid Nozzle -UV mechanism: None -Recognition Camera: CCD Utility: ITEM: SPECIFICATION POWER: 3WIRE+GROUND CUTTING WATER: RC3/8 AIR: RC1/4 COOLING WATER (IN): RC1/4 COOLING WATER(OUT): RC1/4 EXHAUST DUCT: φ101.6mm DRAINAGE DUCT: φ50.6mmOEM Model Description
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.Documents
DISCO
DFD6341
Verified
CATEGORY
Scribing, Cutting, Dicing
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102761
Wafer Sizes:
8"/200mm
Vintage:
2012
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Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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Similar Listings
View AllDISCO
DFD6341
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 13 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102761
Wafer Sizes:
8"/200mm
Vintage:
2012
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available