Overview

The DFL7360FH is a laser saw from Disco Corporation. It is a dedicated tape frame transfer model that realizes high productivity for sapphire and MEMS processing and supports a variety of processes1. It uses Stealth Dicing, a processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander2. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination. It is also a dry process that does not require cleaning, suitable for applications (such as MEMS) that are vulnerable to mechanical load.