Overview

2002 300 mm-compatible Fully Automatic Laser Saw DFL7160 developed. Supports various applications, including full cut and DAF cut Φ300 mm Ablation DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to achieve non-thermal processing. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. Wafer contamination from laser processing particles can be prevented through installation of the HogoMax * coating/cleaning mechanism. *A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface