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Description
-Set up with a UV laser for Glass and GaN -Voltage 200~240 VAC ± 10%, 3 Phase -Equipment component Main body -Main power -Loadlock -Laser type:F type -No ChillerConfiguration
No ConfigurationOEM Model Description
The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.Documents
No documents
PREFERRED
SELLER
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
69038
Wafer Sizes:
8"/200mm
Vintage:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PREFERRED
SELLER
DISCO
DFL7160
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
69038
Wafer Sizes:
8"/200mm
Vintage:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
-Set up with a UV laser for Glass and GaN -Voltage 200~240 VAC ± 10%, 3 Phase -Equipment component Main body -Main power -Loadlock -Laser type:F type -No ChillerConfiguration
No ConfigurationOEM Model Description
The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.Documents
No documents