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DISCO DFL7160
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    Key Item Details

    Condition:Used

    Operational Status:

    Product ID:44876

    Wafer Sizes:Unknown

    Vintage:2010

    Description

    No description available

    Configuration

    – Laser Maximum Power: 18 W – Laser Wavelength: 355 nm – 50/60Hz, 3 Phase, 14amps

    Documents
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    OEM Model Description

    The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.

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