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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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DISCO DFL7160
    Description
    Laser cutting machine
    Configuration
    No Configuration
    OEM Model Description
    The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.
    Documents

    No documents

    DISCO

    DFL7160

    verified-listing-icon

    Verified

    CATEGORY
    Scribing, Cutting, Dicing

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    93233


    Wafer Sizes:

    Unknown


    Vintage:

    2008


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    DISCO DFL7160

    DISCO

    DFL7160

    Scribing, Cutting, Dicing
    Vintage: 2009Condition: Used
    Last VerifiedOver 60 days ago

    DISCO

    DFL7160

    verified-listing-icon
    Verified
    CATEGORY
    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    listing-photo-aca380aebe1f44d8aba177d95c2f3793-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/28358/aca380aebe1f44d8aba177d95c2f3793/1b0cfd1a386d4d57bce36bca01023d49_0d0b890a27e14534b35ab26273de24861201a_mw.jpeg
    listing-photo-aca380aebe1f44d8aba177d95c2f3793-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/28358/aca380aebe1f44d8aba177d95c2f3793/bd63b32c092a4904b6ebe911b8533788_802b19c81ea9497f8319d4a4654b1fc945005c_mw.jpeg
    listing-photo-aca380aebe1f44d8aba177d95c2f3793-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/28358/aca380aebe1f44d8aba177d95c2f3793/55bc8a29045f4ed9943cb1d6a0365c44_6e80d569e87b46baa515f0dd2e2b8fb145005c_mw.jpeg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    93233


    Wafer Sizes:

    Unknown


    Vintage:

    2008


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Laser cutting machine
    Configuration
    No Configuration
    OEM Model Description
    The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.
    Documents

    No documents

    Similar Listings
    View All
    DISCO DFL7160

    DISCO

    DFL7160

    Scribing, Cutting, DicingVintage: 2009Condition: UsedLast Verified:Over 60 days ago
    DISCO DFL7160

    DISCO

    DFL7160

    Scribing, Cutting, DicingVintage: 2008Condition: UsedLast Verified:Over 60 days ago
    DISCO DFL7160

    DISCO

    DFL7160

    Scribing, Cutting, DicingVintage: 2005Condition: UsedLast Verified:Over 60 days ago