The DISCO DTG8440 is a fully automatic Taiko grinder manufactured by DISCO Corporation.

DISCO develops, manufactures, and sells precision machines and precision processing tools.

DISCO

DTG8440

Fully Automated Disco Taiko Grinder - DTG 8440

Taiko-grinding of 8”-wafers with V-notch
Turntable with 3 Chuck Tables for 8”-wafers with V-notch
Fixed-position stop function for the chuck table and spinner table
Z-Axis Indices
2 Low Vibration Air Bearing Spindles
Robotic Wafer Transportation System
T2-arm with vacuum pad, not edge clamping
Vacuum Pump System
Non-recirculating Cutting and Cleaning Water System
Reserve air switching unit for spindle air bearing protection
Spindle Cooling Water System
2 Probe Height Gauges for Measuring
Transfer arm 3 (T-arm in spinner table area) with vacuum pad for 8” wafers with V-Notc
Edge clamping on transfer arms 2 and 3 instead of vacuum pads
Vacuum maintenance using vacuum ejector
Non-Contact Thickness Gauge for normal and high doped wafers
Automatic wheel set-up function
Stayclean injector to reduce contamination on TAIKO wafer


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Fully Automatic Taiko-Grinding System designed for high-precision thinning of semiconductor wafers

Key Features:

2 Low Vibration Air Bearing Spindles
2 Probe Height Gauges for Measuring
Automatic wheel set-up function
Edge clamping on transfer arms 2 and 3 instead of vacuum pads
Fixed-position stop function for the chuck table and spinner table
In-process wafer thickness measurement on Z1 and Z2
Non-Contact Thickness Gauge for normal and high doped wafers
Non-recirculating Cutting and Cleaning Water System
Reserve air switching unit for spindle air bearing protection
Robotic Wafer Transportation System
Signal Tower
Spindle Cooling Water System
Spindle Rotation Speed Monitor
T2-arm with vacuum pad, not edge clamping
Taiko-grinding of 8”-wafers with V-notch
Transfer arm 3 (T-arm in spinner table area) with vacuum pad for 8” wafers with V-Notc
Turntable with 3 Chuck Tables for 8”-wafers with V-notch
Vacuum maintenance using vacuum ejector
Vacuum Pump System
Wafer Cleaner with spinner table
Z-Axis Indices
Wafer backside washing function
Vacuum maintenance using vacuum ejector
SECS/HSMS

DTG8440

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