Description
Fully Automatic Taiko-Grinding System designed for high-precision thinning of semiconductor wafers Key Features: 2 Low Vibration Air Bearing Spindles 2 Probe Height Gauges for Measuring Automatic wheel set-up function Edge clamping on transfer arms 2 and 3 instead of vacuum pads Fixed-position stop function for the chuck table and spinner table In-process wafer thickness measurement on Z1 and Z2 Non-Contact Thickness Gauge for normal and high doped wafers Non-recirculating Cutting and Cleaning Water System Reserve air switching unit for spindle air bearing protection Robotic Wafer Transportation System Signal Tower Spindle Cooling Water System Spindle Rotation Speed Monitor T2-arm with vacuum pad, not edge clamping Taiko-grinding of 8”-wafers with V-notch Transfer arm 3 (T-arm in spinner table area) with vacuum pad for 8” wafers with V-Notc Turntable with 3 Chuck Tables for 8”-wafers with V-notch Vacuum maintenance using vacuum ejector Vacuum Pump System Wafer Cleaner with spinner table Z-Axis Indices Wafer backside washing function Vacuum maintenance using vacuum ejector SECS/HSMSConfiguration
No ConfigurationOEM Model Description
The DISCO DTG8440 is a fully automatic Taiko grinder manufactured by DISCO Corporation.Documents
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DISCO
DTG8440
CATEGORY
Wafer Grinding
Last Verified: 18 days ago
Key Item Details
Condition:
New
Operational Status:
Unknown
Product ID:
152148
Wafer Sizes:
8"/200mm
Vintage:
2025
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Fully Automatic Taiko-Grinding System designed for high-precision thinning of semiconductor wafers Key Features: 2 Low Vibration Air Bearing Spindles 2 Probe Height Gauges for Measuring Automatic wheel set-up function Edge clamping on transfer arms 2 and 3 instead of vacuum pads Fixed-position stop function for the chuck table and spinner table In-process wafer thickness measurement on Z1 and Z2 Non-Contact Thickness Gauge for normal and high doped wafers Non-recirculating Cutting and Cleaning Water System Reserve air switching unit for spindle air bearing protection Robotic Wafer Transportation System Signal Tower Spindle Cooling Water System Spindle Rotation Speed Monitor T2-arm with vacuum pad, not edge clamping Taiko-grinding of 8”-wafers with V-notch Transfer arm 3 (T-arm in spinner table area) with vacuum pad for 8” wafers with V-Notc Turntable with 3 Chuck Tables for 8”-wafers with V-notch Vacuum maintenance using vacuum ejector Vacuum Pump System Wafer Cleaner with spinner table Z-Axis Indices Wafer backside washing function Vacuum maintenance using vacuum ejector SECS/HSMSConfiguration
No ConfigurationOEM Model Description
The DISCO DTG8440 is a fully automatic Taiko grinder manufactured by DISCO Corporation.Documents
No documents