DFG8560
Category
Wafer GrindingOverview
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.
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DISCO
DFG8560
Wafer GrindingVintage: 2016Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG8560
Wafer GrindingVintage: 2005Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG8560
Wafer GrindingVintage: 2006Condition: UsedLast VerifiedYesterdayDISCO
DFG8560
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days ago