DFG850
Category
Wafer GrindingOverview
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.
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DISCO
DFG850
Wafer GrindingVintage: 2000Condition: UsedLast Verified30 days agoDISCO
DFG850
Wafer GrindingVintage: 2000Condition: UsedLast VerifiedOver 30 days agoDISCO
DFG850
Wafer GrindingVintage: 2003Condition: UsedLast VerifiedOver 60 days agoDISCO
DFG850
Wafer GrindingVintage: Condition: UsedLast VerifiedOver 60 days ago
