The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.

DISCO develops, manufactures, and sells precision machines and precision processing tools.

DISCO

DFG850

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Grinder thinning machine

Disco dfg850 8 "back wafer grinding and thinning machine, compatible with 4-5-6" products. It can rotate 3 working plates, and has high efficiency. The company has a team of professional after-sales service engineers to provide equipment installation, commissioning and maintenance services.


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6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

DFG850

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DISCO

DFG850

DISCO

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DFG850

DISCO

DFG850

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