Description
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6 and 8 inch capable comes with vacuum/coolant unit and dut unitOEM Model Description
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.Documents
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DISCO
DFG850
CATEGORY
Wafer Grinding
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
136542
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
6 and 8 inch capable comes with vacuum/coolant unit and dut unitOEM Model Description
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.Documents
No documents