Description
C1 Line, A1 Underfloor Storage FacilityConfiguration
No ConfigurationOEM Model Description
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.Documents
No documents
Similar Listings
View All
DISCO
DFG850
CATEGORY
Wafer Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
124599
Wafer Sizes:
5"/125mm, 6"/150mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
C1 Line, A1 Underfloor Storage FacilityConfiguration
No ConfigurationOEM Model Description
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.Documents
No documents