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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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DISCO DFG850
    Description
    Grinder thinning machine Disco dfg850 8 "back wafer grinding and thinning machine, compatible with 4-5-6" products. It can rotate 3 working plates, and has high efficiency. The company has a team of professional after-sales service engineers to provide equipment installation, commissioning and maintenance services.
    Configuration
    No Configuration
    OEM Model Description
    The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.
    Documents

    No documents

    DISCO

    DFG850

    verified-listing-icon

    Verified

    CATEGORY
    Wafer Grinding

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    79199


    Wafer Sizes:

    8"/200mm


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    DISCO DFG850

    DISCO

    DFG850

    Wafer Grinding
    Vintage: 2000Condition: Used
    Last Verified30 days ago

    DISCO

    DFG850

    verified-listing-icon
    Verified
    CATEGORY
    Wafer Grinding
    Last Verified: Over 60 days ago
    listing-photo-ff93692a1308494b82d5c866d9bdc0e1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/ff93692a1308494b82d5c866d9bdc0e1/dd732bded94b43b4bd2406d25a12589f_dfg850_mw.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    79199


    Wafer Sizes:

    8"/200mm


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Grinder thinning machine Disco dfg850 8 "back wafer grinding and thinning machine, compatible with 4-5-6" products. It can rotate 3 working plates, and has high efficiency. The company has a team of professional after-sales service engineers to provide equipment installation, commissioning and maintenance services.
    Configuration
    No Configuration
    OEM Model Description
    The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.
    Documents

    No documents

    Similar Listings
    View All
    DISCO DFG850

    DISCO

    DFG850

    Wafer GrindingVintage: 2000Condition: UsedLast Verified:30 days ago
    DISCO DFG850

    DISCO

    DFG850

    Wafer GrindingVintage: 2000Condition: UsedLast Verified:Over 30 days ago
    DISCO DFG850

    DISCO

    DFG850

    Wafer GrindingVintage: 2003Condition: UsedLast Verified:Over 60 days ago