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Description
Grinder thinning machine Disco dfg850 8 "back wafer grinding and thinning machine, compatible with 4-5-6" products. It can rotate 3 working plates, and has high efficiency. The company has a team of professional after-sales service engineers to provide equipment installation, commissioning and maintenance services.Configuration
No ConfigurationOEM Model Description
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.Documents
No documents
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79199
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFG850
CATEGORY
Wafer Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79199
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Grinder thinning machine Disco dfg850 8 "back wafer grinding and thinning machine, compatible with 4-5-6" products. It can rotate 3 working plates, and has high efficiency. The company has a team of professional after-sales service engineers to provide equipment installation, commissioning and maintenance services.Configuration
No ConfigurationOEM Model Description
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.Documents
No documents