DGP8761
Category
Lapping, Polishing, GrindingOverview
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.
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DISCO
DGP8761
Lapping, Polishing, GrindingVintage: 2012Condition: UsedLast Verified21 days agoDISCO
DGP8761
Lapping, Polishing, GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoDISCO
DGP8761
Lapping, Polishing, GrindingVintage: Condition: NewLast VerifiedOver 60 days agoDISCO
DGP8761
Lapping, Polishing, GrindingVintage: 2010Condition: UsedLast VerifiedOver 60 days ago
DISCO
DGP8761
Lapping, Polishing, GrindingVintage: 2013Condition: UsedLast VerifiedYesterdayDISCO
DGP8761
Lapping, Polishing, GrindingVintage: 2010Condition: UsedLast Verified6 days agoDISCO
DGP8761
Lapping, Polishing, GrindingVintage: Condition: UsedLast Verified7 days agoDISCO
DGP8761
Lapping, Polishing, GrindingVintage: Condition: UsedLast Verified7 days ago