Description

Available as a standalone unit only, without additional modules or accessories

Configuration

Please find below attachment.

OEM Model Description

The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.

Documents

DISCO DGP8761.pdf

DISCO

DGP8761

Verified

Lapping, Polishing, Grinding

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

127013

Wafer Sizes:

8"/200mm

Vintage:

2017

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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