DISCO develops, manufactures, and sells precision machines and precision processing tools.

The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.

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DGP8761

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