Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

SEMVISION CX 300

COMPLUS 3

Wafer inspection.  Core technology of DUV laser illumination and full polarization control, with simultaneous dual channel (brightfield reflected light and grayfield scattered light) collection optics unique to this product line

sub-10nm defect sensitivity. It also enhances defect inspection on advanced patterning layers in FEOL and BEOL applications for the 1xnm node, addressing technologies that include logic, DRAM, 3D NAND, double and quadruple patterning, and EUV layers.
n addition, the UVision 8 system incorporates Marker 2, the next generation of an integrated CAD-based application that combines customer regions-of-interest information and wafer characteristics based on customer needs. This capability enhances sensitivity while also boosting capture rates of prioritized defects of interest, enabling region-of-interest based binning, and tightening coordinate accuracy


UVISION 8

UVISION SP INSPECTION

The Applied SEMVision G3 FIB integrates advanced defect review SEM capability with automated focused ion beam (FIB) technology in one system. The FIB provides a cross-sectional view of the defects reviewed by the SEM, enabling chipmakers to analyze the defects in minutes as part of their in-line review process.

SEMVISION G3 FIB

The AMAT / APPLIED MATERIALS ComPLUS mp3 wafer measurement system is compatible with 300mm wafer size. The MP (multi perspective) option is an expansion on the ComPLUS platform offering capabilities to perform additional brightfield applications, including the detection of defects in the transistor area such as STI, gate, and tungsten plug layers.

COMPLUS MP3

Applied introduced the Compass Pro system in 2002 for detecting critical defects in devices with design rules as small as 100nm and below. The system operates with the high speed required for chipmakers' volume production lines, especially for copper-based chip manufacturing.

COMPASS 200 PRO

The SEMVision G5 suite offers top-tier in-line defect review and analysis for 22nm and beyond, consolidating Applied's leadership in DR. It boasts unparalleled SEM system speed, precision, and intelligence. With the highest image quality, finest pixel resolution, and 1-nanometer pixel size in production (improved from 2nm), it automates the entire review process. The G5 captures images of defects as minuscule as 10nm in a 0.5µm field, offers superior throughput, and the ADRTrue™ feature distinguishes true defects from false. Its imaging capabilities cover material and topographic perspectives and include an enhanced SEM column, novel charging suppression, and new imaging techniques. Advanced algorithms bolster its functionality, and it provides extensive defect analysis on the wafer's edge, bevel, and apex. The unique EDX module identifies defect elemental compositions and facilitates rapid analysis of defects under 30nm. With a 45-degree SEM column rotation and tilt, it offers 3D data for better defect visualization. SEMVision also provides automated Wavelength Dispersive X-ray (WDX) analysis, enabling in-depth defect analyses below 30nm at unmatched speeds.

SEMVISION G5 MAX

SEMVISION G4 LITE

The Applied SEMVision G7 system offers greater imaging variety and advances in automatic defect classification (ADC) based on expanded machine learning capabilities. Besides the imaging capabilities of the previous SEMVision generation, the new system offers unique imaging of the wafer-edge bevel and apex where undetected defects can reduce device yield. To achieve robust review of unpatterned wafers, an enhanced light source and collection mechanism combined with improved noise suppression enable optical detection of defects as small as 18nm.

SEMVISION G7

The Applied SEMVision G6 combines high-resolution, multi-dimensional imaging capabilities with machine learning intelligence of the Purity automatic defect classification (ADC) system. The SEMVision G6 system's resolution is a 30% improvement over the previous generation, making it the highest available. 

SEMVISION G6

Applied UVisiontm Inspection system, a laser-based 3D brightfield tool. Utilizing multi-beam DUV laser illumination and high efficiency detectors, the UVision system uncovers critical defects on the wafer that have not been detected before by any other system, enabling customers to rapidly resolve performance-limiting defect issues and achieve greater chip yields.

UVISION

The SEMVision G10 is a defect analysis system developed by Applied Materials. It integrates novel cold field emission (CFE) technology and offers industry-leading, sub-1nm resolution to address many of today’s challenges. This high resolution is a critical enabler for EUV photoresist review at >10x reduced eBeam dose.

SEMVISION G10

AMAT / APPLIED MATERIALS SEMVISION G4 MAX is an Automatic defect review and classification system which can be used for 12" wafer sizes.

The Applied SEMVision(TM) G4, which extends the technology and productivity of Applied's highly successful SEMVision system to 45 nm and beyond applications. Key to the SEMVision G4 are its new SEM column technology and enhanced multi-perspective SEM imaging system (MPSI) that deliver state-of-the-art 2nm physical resolution for unmatched image quality at a benchmark one defect-per-second review rate.

The SEMVision G4 brings several advanced defect monitoring capabilities from the engineering floor to in-line volume manufacturing. These vital analytical tools enable customers to rapidly analyze and classify defects as small as 30nm in the most sensitive device layers, such as immersion photoresist and low-k dielectrics. Featuring EDXtreme, a revolution in EDX(1)-based material analysis, the SEMVision G4 extends the chemical characterization of defects to sub-50nm particle sizes. The system's new SEM column can rotate and tilt up to 45 degrees relative to the wafer to provide complete 3-D data for superior defect visualization and classification. In addition, wafer edge and bevel analysis technology address a new frontier of yield enhancement, enabling customers to successfully address immersion-related defectivity issues.

SEMVISION G4 MAX

SEMVISION X

CX 2000

SEMVISION G5 LITE

The SEMVision G5 suite (G5, G5 HP, and G5 MAX) is the fifth generation of this revolutionary technology, providing the fastest, most precise, and smartest SEM system for 22nm and beyond. It offers operator-free automation, high-resolution imaging of true defects as small as 10nm, and comprehensive defect analysis. The system includes advanced features such as enhanced SEM column, charging suppression, imaging of bottom layer defects, high aspect ratio imaging, and automatic EDX module for elemental composition analysis. SEMVision G5 also provides in-line Wavelength Dispersive X-ray (WDX) material analysis. It sets new standards in defect visualization, classification, and cycle times.

SEMVISION G5 GX

WF 730

Using laser-based technology, Applied Materials’ WF-736 system detects defects on patterned wafers (wafers with circuit images printed on them) as they move between processing steps. Defects may include particles, open circuit lines, shorts between  lines or other problems.

WF-736

With throughput up to 1,800 defects per hour and sensitivity down to 30nm, Applied SEMVision G3 HP STAR high productivity system sets industry benchmark for productivity and cost of ownership. Alongside SEMVision G3 STAR and G3 FIB STAR, the addition of SEMVision G3 HP STAR completes the SEMVision family, providing advanced fabs a comprehensive suite of defect review and analysis solutions at optimized productivity.

In addition to its extreme sensitivity and high throughput, the Applied SEMVision G3 HP STAR system features breakthrough Quantified Process Monitoring (QPM) solution that combines high resolution SEM imaging and tailored algorithms to automatically detect and monitor systematic defects. QPM allows monitoring of all wafers with a much larger amount of statistical data, leading to more reliable process information to guide process development and production operation.

Over the last several years, the rapid expansion of in-line SEM review in fabs worldwide created the need for new review strategies. The SEMVision G3 STAR family is a direct response to customer needs for a set of leading-edge tools optimized for different applications, enabling flexible system utilization during all stages of production ramp at the lowest overall cost.

All three systems in the Applied SEMVision family – G3 STAR, G3 HP STAR and G3 FIB STAR – share a single platform, a common user interface and shared recipes. This unique commonality shortens set-up time through extensive recipe sharing, and provides higher availability and WIP control. Using a common platform also lowers operating expenses by sharing spares, service contracts and operating knowledge.

The SEMVision G3 family is part of Applied Materials' Resolution strategy to lead the metrology and inspection market with continuous advances in absolute resolution, root cause, process response and cost per resolution.

SEMVISION G3 HP

DFinder

The RT-8000ES is an advanced reticle inspection system that provides fully automated inspection of up to 10 reticles. It uses advanced die-to-database comparisons to detect defects on all advanced mask types for device design rules down to 0.18µm. The system’s Data Express™ module allows users to perform full-speed inspection of all masks and designs manufactured today, including reticles requiring resolution and process enhancement technologies like Optical Proximity Correction and Phase-Shift Masks, without compromising throughput or selectivity. Additionally, the RT-8000ES features a new “Line Width Error Detector” that provides additional capabilities to help detect misplaced and improperly sized features, edge defects, and line width variations. This makes the RT-8000ES a powerful tool for ensuring the quality and accuracy of reticles used in the semiconductor manufacturing process.

RT-8000ES

The AMAT / APPLIED MATERIALS SEMVISION CX PLUS is a Defect Inspection system. The SEMVISION CX PLUS can produce wafer size of 8”.
Using OperatorFree(tm) EDX (energy dispersive x-ray) analysis, the SEMVision cX features automatic material identification that characterizes defects on unpatterned wafers and provides chipmakers with information on the defect's source. The system also offers high-productivity operation at 500 defects per hour and color MPSI (Multiple Perspective SEM Imaging) for enhanced topography and material information. These features work together to provide chipmakers with fast, reliable defect information on both patterned and unpatterned wafers, alerting them of process excursions and helping identify the defect's source to enable faster time to correction.
EDX technology uses x-ray spectroscopy to identify the precise material composition of many defect types so that users can determine their source.

The SEMVision cX is the first SEM review system to feature OperatorFree EDX analysis that increases processing speed of the system and requires less engineering expertise. For the first time, material information is combined with automated defect classification (ADC) to provide fab engineers with all vital defect data. The automated EDX is used to analyze unpatterned wafers, such as monitor wafers and those with blanket films or planarized surfaces. Since fabs use a large number

SEMVISION CX PLUS

The UVision® 7 system is a member of the successful UVision wafer inspection product family, featuring core technology of DUV laser illumination, with simultaneous dual channel (brightfield reflected light and grayfield scattered light) collection optics unique to this product line.

The system boasts the industry’s smallest optical inspection pixel size (30nm), which enables cutting-edge R&D activities with sub-10nm defect sensitivity. It also enhances defect inspection on advanced patterning layers in FEOL and BEOL applications for the 1xnm node, addressing technologies that include FinFET logic devices, DRAM, 4x 3D NAND, double and quadruple patterning, and EUV layers.

The UVision 7 system is designed for 30% greater light intake compared to the previous-generation tool, pushing the wafer laser power operating limits even further and significantly enhancing sensitivity. The platform also features an enhanced collection system that improves sensitivity in both dense logic and edge-of-array areas, reducing the false alarm rate in these areas by up to 50%. Furthermore, with its more than 40% higher throughput, the tool improves cost of ownership for manufacturing applications.

The UVision 7 system incorporates Marker™, a new integrated CAD-based application that combines customer regions-of-interest information and wafer characteristics to customize detection thresholds to local geometries and noise. This capability enhances sensitivity, improves binning, and tightens coordinate accuracy. The Marker application is a key component in the new system’s value added for process development and manufacturing activities.

UVision 7 is field-upgradable from UVision 6, making its enhanced capabilities readily accessible to customers.

UVISION 7

The WF-731 is a production monitoring system for patterned wafer defect detection that is part of the WF-700 Series Wafer Defect Inspection System. It is designed to enhance yield by providing immediate feedback on critical process steps through its high wafer throughput of 34 WPH at 0.3µm sensitivity. The WF-731, along with the WF-736 DUO engineering analysis system, offers new solutions for yield enhancement by combining brightfield and darkfield imaging. These wafer inspection tools share a common platform, enabling easily transportable engineering recipes and uniformity in training, service, and spare parts. Overall, the WF-731 is a powerful tool for monitoring production processes and detecting defects in patterned wafers.

WF-731

Applied ComPlus-EV Inspection is the industry's only patterned wafer inspection system that performs high-speed inspection of all darkfield and key brightfield applications for 90nm production. Using proprietary Enlarged GrayField technology, this single-system solution detects a broad range of defect types at production throughput, enabling faster ramp and higher production yield.

COMPLUS

The SEMVision G2 is a system that makes possible high-quality topographical images of tiny and shallow defects. Its detection assembly and processing enable high aspect ratio imaging through high dynamic range detection, collection of back-scattered electrons, and energy filtering.. The SEMVision G2 is a line of defect review and analysis tools for 65nm manufacturing and beyond. It can accelerate customers’ production ramp by rapidly identifying the root cause of systematic and yield-limiting defects.

SEMVISION G2 LITE

SEMVision 200CX

Using deep ultraviolet (DUV) laser-based technology, defects can be detected on patterned wafers (wafers with printed circuit images) as they move between processing steps. Defects include particles, open circuit lines, and shorts between lines. The Applied UVision 6 wafer inspection system detects yield-limiting defects in the critical patterning layers of logic and memory devices.

The UVision® 6 system, featuring the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system further enhances defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications down to the 1xnm node, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers.

UVISION 6

The SEMVision G4 is part of the Applied SEMVision™ family, which is the industry’s fastest and most sensitive line of defect review and analysis tools for 65/45nm manufacturing and beyond. The new line of three systems sets the industry benchmark with 30nm sensitivity and throughputs of up to 2,400 defects per hour. The SEMVision G4 brings several advanced defect monitoring capabilities from the engineering floor to in-line volume manufacturing. These vital analytical tools enable customers to rapidly analyze and classify defects as small as 30nm in the most sensitive device layers, such as immersion photoresist and low-k dielectrics.

SEMVISION G4 HP

The WF-736 DUO is an engineering analysis system that, along with the WF-731 production monitoring system, provides new solutions for yield enhancement in patterned wafer defect detection. The WF-736 DUO combines brightfield and darkfield imaging to achieve a sensitivity of 0.1µm on advanced design rule applications. The WF-731, on the other hand, delivers high wafer throughput (34 WPH at 0.3µm sensitivity) for immediate feedback on critical process steps. These wafer inspection tools are part of a family that offers the first defect detection systems with a common platform, enabling easily transportable engineering recipes and uniformity in training, service, and spare parts. 

WF-736 DUO

The SEMVISION G5 is part of the Applied SEMVision™ family, which is the industry’s fastest and most sensitive line of defect review and analysis tools for 65/45nm manufacturing and beyond. The new line of three systems sets the industry benchmark with 30nm sensitivity and throughputs of up to 2,400 defects per hour. Used in an optimized defect review strategy, these systems can accelerate customers’ production ramp by rapidly identifying the root cause of systematic and yield-limiting defects.

SEMVISION G5 HP

Semvision G5, enables chipmakers to image and analyze 20nm yield-limiting defects in a production environment without manual intervention. Uniquely capable of identifying and imaging relevant defects with 1nm pixel size, the SEMVision G5 system allows logic and memory customers to streamline manufacturing, pinpointing the root cause of defects faster and more accurately than ever before."
The breakthrough SEMVision G5 system is an open architecture platform that dynamically combines data received from a wafer inspection system with a library of predefined review strategies. The system automatically creates new review recipes - a major benefit over competing tools that require time-consuming manual recipe creation for every chip type to be inspected. This feature is critical for foundry customers that must rapidly achieve good yield in the thousands of new chip designs they manufacture each year.

SEMVISION G5

The ComPlus-EV system solution delivers exceptional advantages in system sensitivity and throughput, as well as significant savings to customers who typically purchase multiple highly-specialized inspection tools to cover the same range of applications. Using proprietary EnlargedGrayField technology, the ComPlus-EV detects a broad range of defect types at production speeds, including the most challenging ultra-small and flat pattern defects, as well as CMP(chemical mechanical polishing) copper interconnect and photolithography process defects.The new EZSet automatic recipe creator greatly reduces recipe creation and optimization time, for higher system availability. With its embedded connectivity to the SEMVision(TM) defect review system, ComPlus-EV delivers fast time-to-data for rapid fault detection.
The ComPlus-EV can be further enhanced with the MP (Multi-Perspective) option, whichextends the system's exceptional capabilities to perform additional brightfield applications,including the detection of defects in the transistor area such as STI, gate, and tungsten plug layers. The MP option expands the number of detectors and magnifications, enabling higher sensitivity to flat defects at an increased capture rate, providing significantly higher throughput and reduced cost of ownership.

COMPLUS EV

The Complus 4T enables users to detect surface particles, pattern flaws, and other conditions that may compromise a completed device. Wafer Inspection: 6\"-12\" wafers"
Efficient nuisance filtering and on-the-fly (OTF) defect grouping allow process excursion control based on defect-of-interest, accelerating defect resolution. Seamless connectivity between ComPLUS 4T and SEMVision defect review systems eases information transfer between the two, and also allows inspection recipe tuning on the review system, dramatically improving productivity of both the inspection and the review systems.
Applied ComPLUS 4T Inspection is a Darkfield wafer inspection system that performs high-speed defect and process monitoring for 65nm production. Using dual-angle illumination, a proprietary enlarged GrayField technology, and advanced noise suppression techniques, ComPLUS 4T detects a broad range of defects at production throughput with 20% higher capture rate on critical defects, enabling faster ramp and higher production yield.

COMPLUS 4T

COMPASS PRO 300

Compass 300 Inspection system, tailored for monitoring processes up to the 100nm tech node. Detect critical flaws efficiently using OMNIView™, a cutting-edge laser scanning method that captures diverse defects across all layers.

COMPASS 300

The Applied UVision 5 wafer inspection system detects yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. Applied also offers the Applied DFinder system, the first darkfield wafer inspection system to use DUV laser scanning to detect particles as small as 40nm in interconnect layers.

The UVision® 5 system isa member of the UVision wafer inspection product family, supporting the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield  (BF) reflected light and grayfield (GF) scattered light] collection optics. 

The system exhibits new defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications for 2xnm production and beyond, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers. The UVision 5 system’s dramatically increased light density enables detection of 1xnm killer defects - some never captured before - resulting in a twofold improvement in killer defect capture rates. This, in turn, results in a more accurate and comprehensive defect Pareto that significantly improves statistical process control in the wafer fab.

The platform’s unique GF detection architecture now captures more light to enable detection of defects in the range of 1xnm (approximately the width of up to five DNA strands). New imaging modes improve detection sensitivity to further increase UVision technology leadership in GF scanning. Novel image processing algorithms reduce wafer noise by up to 50% in various types of memory structures, contributing to a higher capture rate, especially on BEOL layers.  

UVISION 5

The Applied UVision® 4 wafer Inspection system was introduced in 2010, enabling customers to detect yield-limiting defects in the critical patterning layers of 32nm and below logic and memory devices using DUV laser-based imaging technology.
The UVision 4 system’s extendable architecture of high-power polarized deep ultra-violet laser, optimized scattered
light collection, and advanced noise reduction capabilities, addresses the inspection challenges of 32nm and below
with optical inspection capabilities beyond the resolution limits of conventional brightfield (BF) inspection.

Innovative algorithms enable
simultaneous detection of systematic mask induced defects (i.e., "haze" defects) and random defects at production
worthy throughput made possible by an enhanced image processor. Wide dynamic range detection schemes
eliminate the multiple region-specific scans previously required, enabling regions of a chip with differing contrasts to
be imaged with optimal sensitivity in a single pass without compromising throughput.

UVISION 4

The SEMVision G3 Lite is a part of Applied Materials’ SEMVision G3 family, which is the industry’s fastest and most sensitive line of defect review and analysis tools for 65/45nm manufacturing and beyond. The new line of three systems sets the industry benchmark with 30nm sensitivity and throughputs of up to 1,800 defects per hour.

SEMVISION G3 LITE

Applied Compass, a patterned wafer inspection systems designed for process monitoring down to the 100nm technology node. Critical defects are detected at production worthy throughput with OMNIView™, a multi-perspective laser scanning technology ensuring robust detection of a wide variety of defect types across all process layers. Compass is a high performance production tool and has the technology required for fast introduction of new technologies to volume production.

COMPASS 200

The AMAT / APPLIED MATERIALS ComPLUS 3T wafer inspection system detects defects in devices with design rules of 65nm and below. The AMAT / APPLIED MATERIALS ComPLUS 3T is used for darkfield applications. The The AMAT / APPLIED MATERIALS ComPLUS 3T wafer and mask inspection system can be used for 12" wafers.

Applied ComPlus 3T Inspection is a patterned wafer inspection system that performs high-speed inspection of all Darkfield and BEOL Brightfield applications for 65nm production. Using dual-angle illumination and proprietary Enlarged GrayField technology, this single-system solution detects a broad range of defect types at production throughput, enabling faster ramp and higher production yield.

Based on the highly successful Compass platform, the ComPlus 3T system transcends the boundaries of traditional darkfield and brightfield inspection, covering the widest optical inspection spectrum with one platform. The ComPlus 3T system solution delivers exceptional advantages in system sensitivity and throughput, as well as significant savings to customers who typically purchase multiple highly specialized inspection tools to cover the same range of applications.

COMPLUS 3T

The high-throughput, fully automatic Applied SEMVision G3 Defect Analysis products enable customers to use this technology as an integral part of their production lines to analyze defects as small as 30nm with industry-leading throughput.

DR-SEMs review defects on the wafer (such as particles, scratches or residues) that are first located by a defect detection system and then classify the defects to identify their source. The high-throughput, fully automatic Applied SEMVisiontm G3 Defect Analysis products enable customers to use this technology as an integral part of their production lines to analyze defects as small as 30nm with industry-leading throughput. The Applied SEMVision G3 FIB integrates advanced defect review SEM capability with automated focused ion beam (FIB) technology in one system. The FIB provides a cross-sectional view of the defects reviewed by the SEM, enabling chipmakers to analyze the defects in minutes as part of their in-line review process.

SEMVISION G3

SEMVISION GX

UVISION 600SP

AMAT / APPLIED MATERIALS ComPlus MP is a wafer inspection system which can be used with 8" wafer sizes.

The ComPlus-EV can be further enhanced with the MP (Multi-Perspective) option, which extends the system's exceptional capabilities to perform additional brightfield applications, including the detection of defects in the transistor area such as STI, gate, and tungsten plug layers. The MP option expands the number of detectors and magnifications, enabling higher sensitivity to flat defects at an increased capture rate, providing significantly higher throughput and reduced cost of ownership.

COMPLUS MP

SEMVision™ is a powerful tool designed to be fully integrated into the defect reduction cycle for advanced production lines. It delivers high throughput and automated defect review using high-resolution scanning electron microscope (SEM) technology and imaging. This means that it can quickly and accurately identify and analyze defects in the production process, helping to improve the overall quality and efficiency of the production line.

SEMVision

The AMAT SEMVision G2 is a high-throughput, fully automatic Defect Analysis system developed by Applied Materials (AMAT). It is designed to be seamlessly integrated into production lines, allowing customers to analyze defects with exceptional productivity. The system is capable of detecting and analyzing defects as small as 50nm, providing crucial insights into the quality and performance of semiconductor devices during manufacturing. 

SEMVISION G2

The SEMVision cX is designed for the automatic review and classification of wafer defects in advanced semiconductor production lines. It builds on the company’s SEMVision system and features automatic material identification that characterizes defects on unpatterned wafers and provides chipmakers with information on the defect’s source. The system also offers high-productivity operation at 500 defects per hour and color MPSI (Multiple Perspective SEM Imaging) for enhanced topography and material information. The SEMVision cX is the first SEM review system to feature OperatorFree EDX (energy dispersive x-ray) analysis that increases processing speed of the system and requires less engineering expertise. For the first time, material information is combined with automated defect classification (ADC) to provide fab engineers with all vital defect data.

SEMVision cX

SEMVISION CX200

UVISION 200

The fourth generation Applied SEMVision is the fastest and most advanced line of SEM defect review and analysis systems for 45nm manufacturing and beyond. Building on 10 years of technical innovation and leadership, SEMVision G4 products (G4, G4 HP, and G4 MAX) offers the most productive and cost-effective path to in-line defect resolution.

G4
SEMVision G4 delivers high-throughput, in-line defect review and analysis with high resolution and state-of the-art algorithms for production and engineering applications. Imaging capabilities include enhanced MPS with five detectors for simultaneous imaging of material and topographic perspectives; voltage contrast and high aspect ratio (HAR) imaging; and a secondary electron spectrometer for bottom layer defects. Comprehensive defect analysis on the wafer's edge, bevel, and apex addresses critical defect migration issues associated with 32nm immersion lithography.

EDXtreme [advanced automatic EDX (energy dispersive x-ray)] enables fast, full-spectrum acquisition material analysis of defects as small as sub-50nm particles. SEM column's rotatation and tilt flexibility up to 45° relative to the wafer makes available complete 3D data for superior defect visualization and classification.

G4 HP
SEMVision G4 HP sets the industry standard for productivity and cost of ownership with record sensitivity for unpatterned wafer review. Capable of automatically imaging 30nm defects at high throughput, the system supplements the G4's imaging capabilities with Automatic Process Inspection (API) and Quantified Process Monitoring (QPM) that combine high-resolution SEM imaging with tailored algorithms for automatic detection and monitoring of systematic defects.

G4 MAX 
SEMVision G4 MAX is the sole defect review tool to offer automated in-line Wavelength Dispersive X-ray (WDX) material analysis for definitive identification of all existing elements. Combining the extreme energy resolution of WDX with the full-spectrum coverage and high throughput of EDXtreme, G4 MAX enables robust analysis of defects as small as 50nm at record cycle times.

SEMVISION G4

The WF-736 XS system is an enhanced version of the WF-736 system introduced by Applied Materials in fiscal 1999. This system offers greater sensitivity for devices with a size of 0.15 microns and below, making it suitable for the production of advanced microchips.

WF-736 XS

STING

COMPLUS 2T

WF 720

"The high-throughput, fully automatic Applied SEMVision G2 Defect Analysis system enables customers to use this technology as an integral part of their production lines to analyze defects as small as 50nm with high productivity."

SEMVISION G2+E

Applied UVision® 3 system, the industry’s highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography. Delivering significant advancements to Applied’s breakthrough UVision technology, this next-generation system triples the number of laser beams scanning the wafer to provide 40% faster throughput than any competitive system. Two new imaging modes extend sensitivity to 20nm, and a new flexible automatic defect classification engine enables quick access to defects of interest and faster yield learning.

imaging modes in the illumination and collection path which address the contrast versatility required for periphery areas; innovative algorithms of high defect accuracy and stitch-to-stitch detection enable enhanced sensitivity on edge of array and on high-end devices; dual screen configuration with High Resolution Review, which minimizes SEM review time; and new automatic classification capabilities provide quick access to defect-of-interest to reduce yield learning cycle. Additionally, UVision 3’s proprietary ActiveScan technique dynamically compensates for process and color variations within and across wafers.

UVISION 3

As part of the SEMVision G2 family, Applied SEMVision G2 Plus Defect Analysis system is the production-proven workhorse for inline defect review and analysis for the 65nm era. Continuing the productivity leadership of the SEMVision product line, G2 Plus delivers high throughput, extreme sensitivity and automated calibrations, offering the most advanced capabilities for production and engineering applications. Field proven applications such as High Aspect Ratio imaging, tilt imaging and material analysis provide customers the ability to control their defects and processes with greater success, leading to higher yields and faster time to market.

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