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SEMVISION CX PLUS

Overview

The AMAT / APPLIED MATERIALS SEMVISION CX PLUS is a Defect Inspection system. The SEMVISION CX PLUS can produce wafer size of 8”. Using OperatorFree(tm) EDX (energy dispersive x-ray) analysis, the SEMVision cX features automatic material identification that characterizes defects on unpatterned wafers and provides chipmakers with information on the defect's source. The system also offers high-productivity operation at 500 defects per hour and color MPSI (Multiple Perspective SEM Imaging) for enhanced topography and material information. These features work together to provide chipmakers with fast, reliable defect information on both patterned and unpatterned wafers, alerting them of process excursions and helping identify the defect's source to enable faster time to correction. EDX technology uses x-ray spectroscopy to identify the precise material composition of many defect types so that users can determine their source. The SEMVision cX is the first SEM review system to feature OperatorFree EDX analysis that increases processing speed of the system and requires less engineering expertise. For the first time, material information is combined with automated defect classification (ADC) to provide fab engineers with all vital defect data. The automated EDX is used to analyze unpatterned wafers, such as monitor wafers and those with blanket films or planarized surfaces. Since fabs use a large number

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