Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

UVISION 200

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AMAT UVISION 200 Configuration.xlsx

AMAT UVISION 200 packing list.pdf

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Operator console.jpg

System has always been under full service contract and is in very good conditioning.
Uvision SP 200 is a BF (Bright Field) wafer inspection tool 
It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers
Ligth source: Laser ( ג= 266 nm)
Tool scans a wafer in a meander path
Die to Die ” and Cell to Cell ” comparison capability
Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection
On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe


6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

UVISION 200

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APPLIED MATERIALS (AMAT)

UVISION 200

APPLIED MATERIALS (AMAT)

UVISION 200

APPLIED MATERIALS (AMAT)

UVISION 200

APPLIED MATERIALS (AMAT)

UVISION 200

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