LAM RESEARCH CORPORATION

2300e5 KIYO EX

TCP 9600CFE

2300 V2 FLEX 

2300 FLEX E

CORONUS HP

2300 Syndion C is a product in the Syndion etch product family that provides the layer-by-layer process flexibility and control needed for cost-efficient via etch for TSV applications. It offers high process flexibility, superior profile control, and excellent uniformity to address multiple TSV etch applications. It also has a low cost of ownership due to high etch rates, excellent repeatability, and in-situ etching of multiple materials in the TSV stack. Both conventional single-step etch and rapidly alternating process (RAP) are supported. Key applications include TSV for CMOS 3D IC and TSV for image sensors.

2300 SYNDION-C

RAINBOW 4450

2300E4 EXELAN FLEX DX

The Kiyo C series is part of Lam’s Kiyo product family, which delivers high-performance capabilities for conductor etching in semiconductor devices. Conductor etching is a crucial process that shapes the electrically active materials in a semiconductor device, and even slight variations can impact device performance. The Kiyo C series offers superior uniformity and repeatability, enabled by a symmetrical chamber design, industry-leading electrostatic chuck technology, and independent process tuning features. It also provides high productivity with low defectivity on multi-film stacks, thanks to its in-situ etch capability, continuous plasma, and advanced waferless auto-clean technology. Additionally, the Kiyo C series is upgradable, providing a low cost of ownership over several device generations.

2300 KIYO C

ARGOS

AKARA

2300 KIYO MCX

The 2300 Versys is a part of Lam’s 2300 etch series, which is a low-risk solution for sub-100-nm volume production on 300-mm substrates. It has a compact design that reduces floor space while providing full service access. The Versys conductor etch systems rely on Lam’s Transformer Coupled Plasma™ source and deliver superior performance. It also reduces cost of ownership to compete with the lowest cost systems in the industry.

2300 VERSYS

The 2300 Flex F is part of Lam’s Flex product family, which offers differentiated technologies and application-focused capabilities for critical dielectric etch applications. Dielectric etch is the process of carving patterns in insulating materials to create barriers between the electrically conductive parts of a semiconductor device. This process faces multiple challenges due to new materials, complex new integration schemes, and scaling at advanced technology nodes. The 2300 Flex F offers exceptional uniformity, repeatability, and tunability enabled by a unique multi-frequency, small-volume, confined plasma design. It also provides high productivity with low defectivity, enabled by in-situ multi-step etch and continuous plasma capability. Additionally, it offers low-risk, cost-effective upgrades that extend product life and maximize return on investment.

2300 FLEX F

2300e6 KIYO EX

The AutoEtch 480 system is a plasma etcher that offers a high level of automation through its Recipe™ Programming Module. This solid-state module is compact and easy to use, allowing for automatic entry of all process parameters, including flow rates, pressure, RF power, substrate temperature, and electrode spacing. This makes programming the AutoEtch 480 quick and simple.

AUTOETCH 480

2300 METAL 45

The 2300 Kiyo E is part of Lam’s Kiyo product family, which delivers high-performance capabilities to precisely and consistently form conductive features with high productivity. The Kiyo E series is designed to address the challenges of the semiconductor industry, such as processing smaller features, new materials, and new transistor structures on the wafer. It offers superior uniformity and repeatability, enabled by a symmetrical chamber design, industry-leading electrostatic chuck technology, and independent process tuning features. Additionally, it has high productivity with low defectivity on multi-film stacks, enabled by in-situ etch capability, continuous plasma, and advanced waferless auto-clean technology. The Kiyo E series also offers improved critical dimension uniformity using proprietary Hydra technology that corrects for incoming patterning variability and atomic-scale variability control with production-worthy throughput enabled by plasma-enhanced ALE capability. The product is upgradable for low cost of ownership over several device generations.

2300 KIYO E

Rainbow 4400,  4500,  4600  and  4700 series  for  etching  polysilicon,  oxide, aluminum  and  tungsten  films,  respectively. The Rainbow series of products addresses processes that utilize wafer sizes up to 200mm  and feature  sizes as small  as 0.35 micron. 

RAINBOW 4700

2300 FLEX D

2300 E4 FLEX EX

2300 VERSYS METAL M

The 2300 Versys Metal45 addresses backend metal etch uniformity and throughput needs for memory customers at 70 nm and beyond as well as metal hard mask applications for logic customers at 45 nm and beyond. 

2300 VERSYS METAL45

2300 VERSYS W

The 2300 Flex G is part of Lam’s Flex product family, which offers differentiated technologies and application-focused capabilities for critical dielectric etch applications. Dielectric etch is the process of carving patterns in insulating materials to create barriers between the electrically conductive parts of a semiconductor device. The Flex G series is designed to address the challenges of dielectric etch, including the ability to etch multi-layer film stacks with extreme selectivity, creating optimal etched profiles at increasingly higher aspect ratios, and providing repeatable dimension control in high-volume production. The Flex G series offers exceptional uniformity, repeatability, and tunability enabled by a unique multi-frequency, small-volume, confined plasma design. It also provides high productivity with low defectivity, enabled by in-situ multi-step etch and continuous plasma capability. Additionally, the Flex G series offers low-risk, cost-effective upgrades that extend product life and maximize return on investment.

2300 FLEX G

The 2300 Versys HP addresses metal etch requirements for the 90 nm node and beyond.

2300 VERSYS HP

2300 Serene wet clean system is targeted at applications requiring high-selectivity residue removal without damaging sensitive device structures.

2300 SERENE

The 2300 Motif is a post-lithography pattern enhancement system by Lam Research. It uses plasma etch technologies to reduce the original printed critical dimension of a feature by as much as 50 nm for holes and 100 nm for trenches, delivering well-controlled final CDs as small as 10 nm. The film deposited by the Motif system enhances plasma etch resistance, reducing line roughening and distortion during pattern shrinking and transfer. The Motif technology can also be used for double patterning with CD shrink to enable both feature size and pitch scaling, as well as for removable spacers that simplify otherwise costly and complicated processes.

2300 MOTIF

2300 E4 KIYO MCX

2300 E4 FLEX DL

The 2300 Syndion, which also employs TCP technology, addresses 3-D IC through-silicon via (TSV) etch applications. TSVs provide the interconnects for die-to-die and wafer-to-wafer stacking, eliminating wire bonding to increase device packing density (smaller form factor) and improve performance (higher process speed and lower power requirements). Important for TSV applications, the Syndion’s TCP-based technology enables sequential processing the same chamber while ensuring etch rate uniformity and profile symmetry to prevent tilting. The technology also supports clean mode operation and provides bias voltage control for process repeatability.

2300 SYNDION

The 2300 Coronus is a plasma-based bevel clean system developed by Lam Research. It removes yield-limiting defect sources from the wafer edge, maximizing yield. The system combines plasma cleaning with proprietary confinement technology to protect the die area. It is flexible and robust, allowing for removal of different materials within the same chamber for a wide range of wafer cleaning applications. The Coronus system incorporates Lam Research’s Dynamic Alignment technology for highly accurate wafer placement and encroachment control.

2300 CORONUS

The 2300 Kiyo F is part of Lam’s Kiyo product family, which delivers high-performance capabilities for conductor etching in semiconductor devices. Conductor etch helps shape the electrically active materials used in the parts of a semiconductor device, and even a slight variation in these miniature structures can impact device performance. The Kiyo F series offers superior uniformity and repeatability, high productivity with low defectivity on multi-film stacks, improved critical dimension uniformity, atomic-scale variability control with production-worthy throughput, and upgradability for low cost of ownership over several device generations.

2300 KIYO F

The 2300 Versys Metal L is part of Lam’s Versys Metal product family, which provides high-productivity capability on a flexible platform for performing critical etch steps in the semiconductor manufacturing process. The technology used is Reactive Ion Etch, and it provides solutions for interconnects. The product is designed to address industry challenges such as achieving repeatable profile and critical dimension control while maintaining high-volume, low-cost production. It offers superior CD, profile uniformity, and uniformity control, enabled by a symmetrical chamber design with independent process tuning features. Additionally, it has high availability, high yield, and exceptional process repeatability with proprietary chamber cleaning technology. The product is upgradable for low cost of ownership over several device generations. Key applications include TiN metal hardmask, high-density aluminum line, and aluminum pad.

2300 VERSYS METAL L

2300 EXELAN FLEX FX

Lam’s 2300 Versys Star silicon etch system is designed to meet the challenging needs of sub-90-nm technologies. It delivers superior performance on complex film stacks and meets the requirements for next-generation silicon etch processes to sub-65 nm. The system provides excellent CD bias uniformity, enabled by the industry’s first technologies for tuning gas flows and wafer temperature with step-by-step settings. This allows flexibility in designing the process across the wafer and between steps, leading to a larger process window that can accommodate an extensive variety of applications, wafer types, and film types. The 2300 Versys Star is available as an upgrade to existing 2300 Versys systems.

2300 VERSYS STAR

2300 FLEX C

RAINBOW 4470

RAINBOW 4720XL

 The AutoEtch product line includes the 490, 590, 690 and 790 series for etching polysilicon, oxide, aluminum and tungsten film, respectively. Although the AutoEtch series is more than fifteen years old, continued improvements in both reliability and performance have enabled Lam to continue to offer it as a suitable product for applications involving line widths of 0.8 micron or greater and wafer sizes of six inches or smaller.

AUTOETCH 790

REACTIVE ION ETCH (RIE)

Conductor etch helps shape the electrically “active” materials of a semiconductor device. Even a slight variation in these miniature structures can degrade device performance. In fact, these structures are so tiny and sensitive that etch processes push the boundaries of the basic laws of physics and chemistry.

Lam’s Kiyo® product family delivers the high-performance capabilities needed to precisely and consistently form these features precisely and with high productivity. For some applications, select models are also available through our Reliant® Systems as refurbished products, providing lower cost of ownership with the same quality assurance and performance as new systems.

2300 KIYO GX

2300 Flex FXP

The 2300 Exelan Flex is a dielectric etch solution that extends the capabilities of the 2300 Exelan to address manufacturing challenges for 200 mm and 300 mm while providing advanced capabilities for future manufacturing needs. It incorporates Dual Frequency Confined™ (DFC™) technology and the Waferless AutoClean™ process, with additional technology that allows customers to address future production challenges via increased 193 nm photoresist compatibility, enhanced uniformity and CD control, and enlarged process windows. The 2300 Exelan Flex’s innovative technology has been production proven at numerous leading IC manufacturers.

2300 EXELAN FLEX

The LRC Rainbow Etchers are fully automated, in-line, single-wafer plasma/RIE etching systems that processes 6-inch, or 8-inch wafers and features top or/and bottom powered electrode plate, programmable electrode spacing, and automatic noncontact wafer alignment and placement. Unique RF match networks are located at the upper and lower electrodes for programmable switching between plasma and RIE modes. Designed for continuous operation, the LRC Rainbow etchers are computer-controlled, allowing either manual or automatic control. The Lam Rainbow 44XX Series can be for Tungsten silicide, Silicon nitride, polysilicon ,oxide, Crystallise Si etc.

RAINBOW 4420

The AutoEtch 490 is part of the AutoEtch family, which was Lam’s initial product line. The first AutoEtch product was sold in January 1982. The AutoEtch product line includes the 490, 590, and 690 series for etching polysilicon, oxide, and aluminum film applications, respectively. Despite being more than fourteen years old, continued improvements in both reliability and performance have enabled Lam to continue to offer the AutoEtch series as a suitable product for film applications involving line-widths of 0.8 micron or greater and wafer sizes of six inches or smaller. 

AUTOETCH 490

2300 EXELAN FLEX45

The Rainbow 4520 is a state-of-the-art Silicon Dioxide Etching system that is fully automated and capable of processing wafers of various sizes, including 4-, 5-, 6-, and 8-inch wafers. This advanced system features a top powered electrode plate, programmable electrode spacing, and automatic wafer alignment and placement, ensuring precise and efficient etching. With its advanced capabilities, the Rainbow 4520 is an ideal solution for high-quality Silicon Dioxide Etching.

RAINBOW 4520

2300

The Rainbow® 4520i system is a single wafer, vacuum load-locked low pressure oxide system with two active processing chambers. It is designed for integrated isotropic/anisotropic profile on high aspect ratio contact and via structures. The Isotropic Module adds isotropic oxide etching capabilities to the existing anisotropic capabilities of the Rainbow 4520, providing excellent aluminum step coverage. The Isotropic Module is incorporated onto the entrance load-lock on the Rainbow 4520, requiring only one additional wafer handling step. Having two chambers on a single machine greatly reduces the possibility of cross contamination between processes, which minimizes wafer breakage and defect densities. The system has a high uptime of ≥ 85% and is capable of isotropic etching for dielectric (oxide) films. The Rainbow® 4520i system has several applications, including contact etch, planarization, via etch, trench mask etch, and pad etch.

RAINBOW 4520i

2300e5 EXELAN FLEX FX

TCP 9600 is a high-density, low-pressure system from Lam’s TCP product line. It was introduced in late 1992 and incorporates the Company’s patented Transformer Coupled Plasma-TM- source technology for etching 0.35 micron and smaller geometries. The TCP 9600 series is designed for metal etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode. This improves etch results across a wider process window and offers customers a reliable, lower cost of ownership solution to their advanced needs.

TCP 9600

2300 EXELAN FLEX EX+

The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below. 

2300 EXELAN

The Rainbow 4520XL is part of Lam Research’s Rainbow series of etch systems. This series addresses processes for wafers up to 200mm and feature sizes as small as 0.35 micron. The Rainbow product line includes the 4400, 4500, 4600, and 4700 series for etching polysilicon, oxide, aluminum, and tungsten films. These systems offer improved etch capability, reliability, and performance through unique features such as a patented wafer handling system and a proprietary source for generating stable plasma.

RAINBOW 4520XL

RAINBOW 4720

ALLIANCE 6 (A6)

The AutoEtch 590 is part of Lam Research Corporation’s AutoEtch product line, which was first introduced in January 1982. The AutoEtch series includes the 490, 590, and 690 series, designed for etching polysilicon, oxide, and aluminum film applications, respectively. The AutoEtch 590 is suitable for film applications involving line-widths of 0.8 microns or greater and wafer sizes of six inches or smaller. Despite being over fourteen years old, the AutoEtch series has undergone continued improvements in both reliability and performance.

AUTOETCH 590

The Rainbow 4500 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow series includes the 4400, 4500, 4600, and 4700 for etching polysilicon, oxide, aluminum, and tungsten films respectively. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow series incorporates unique features that offer improved etch capability, reliability, and performance, including a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features are designed to enable semiconductor manufacturers to reduce wafer particle contamination to a level that exceeds industry standards and improve etch selectivity and uniformity while maintaining profile control and process flexibility.

RAINBOW 4500

2300 METAL H

The Rainbow 4600 is part of the Rainbow series of etch systems, first introduced in 1987. This series of products addresses processes that utilize wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow 4600 is specifically designed for etching tungsten films. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow product series incorporates a number of unique features that offer semiconductor manufacturers improved etch capability, reliability, and performance. These features include a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design for which Lam has received industry awards for quality and reliability. These and other features of the Rainbow product are designed to enable the semiconductor manufacturer to reduce wafer particle contamination to a level that exceeds industry standards, and to improve etch selectivity and uniformity while maintaining profile control and process flexibility.

RAINBOW 4600

The 2300 Versys Kiyo45 is a Reactive Ion Etch (RIE) system from Lam Research, part of the Kiyo Product Family. It is used to shape the electrically active materials of a semiconductor device with high precision and consistency. The Kiyo product family is known for its high-performance capabilities and productivity. The Versys Kiyo45 is used for various applications, including shallow trench isolation, source/drain engineering, high-k/metal gate, FinFET and tri-gate, and multi-patterning. It enables processing at sub-65 nm technology nodes.

2300 VERSYS KIYO45

2300 VERSYS METAL

The LAM Rainbow 4620 is a Etchers & Ashers system. The Rainbow 4620 can be used with 8” wafer sizes. Its installation type is a Bulkhead mount configuration. The LAM Rainbow 4620 has a Cassette Interface with Hine 38A Wafer Indexers Ergo-Loader Option and Dual Endpoint Detection.

RAINBOW 4620

AUTOETCH 490, 590, 690 series for  etching polysilicon, oxide  and aluminum film applications, respectively. 

AUTOETCH 690

Rainbow 4400 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow 4400 is designed for etching polysilicon films and incorporates unique features such as a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features enable semiconductor manufacturers to reduce wafer particle contamination, improve etch selectivity and uniformity while maintaining profile control and process flexibility.

RAINBOW 4400

2300 EXELAN FLEX EX

The 4520XLE system has a wide process flexibility that allows fabs to develop processes for multiple dual damascene structures and investigate how well each can integrate into the interconnect process. Its broad process window provides this flexibility through independently controlled power settings that regulate charged particle flux and energy along with a wide operating pressure range. The system is able to run high pressure processes in situ, such as photoresist strip and nitride finish etch, eliminating extra wafer handling steps. This in situ process capability lowers overall costs per wafer.

RAINBOW 4520XLe

RAINBOW 4420XL

2300 KIYO FX

The 2300 Versys Kiyo is a manufacturing tool designed for 65 nm and beyond. It provides excellent uniformity and defect control on a reliable wafer transport system. The symmetric chamber and radial tuning features produce uniform etch results for advanced devices. It employs proprietary technology for process repeatability, low defect, and metal contamination results. It supports conventional applications such as gate and shallow trench isolation (STI) and emerging applications such as high k dielectric removal, critical spacer etch, and lithography-enabling etch steps. The system can be upgraded from the 2300 Versys Star, providing an investment-extending strategy.

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LAM RESEARCH CORPORATION

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2300 SYNDION

2300 VERSYS W

2300 KIYO C

AUTOETCH 790

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