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The 2300 Versys Kiyo is a manufacturing tool designed for 65 nm and beyond. It provides excellent uniformity and defect control on a reliable wafer transport system. The symmetric chamber and radial tuning features produce uniform etch results for advanced devices. It employs proprietary technology for process repeatability, low defect, and metal contamination results. It supports conventional applications such as gate and shallow trench isolation (STI) and emerging applications such as high k dielectric removal, critical spacer etch, and lithography-enabling etch steps. The system can be upgraded from the 2300 Versys Star, providing an investment-extending strategy.
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