Overview

Lam’s 2300 Versys Star silicon etch system is designed to meet the challenging needs of sub-90-nm technologies. It delivers superior performance on complex film stacks and meets the requirements for next-generation silicon etch processes to sub-65 nm. The system provides excellent CD bias uniformity, enabled by the industry’s first technologies for tuning gas flows and wafer temperature with step-by-step settings. This allows flexibility in designing the process across the wafer and between steps, leading to a larger process window that can accommodate an extensive variety of applications, wafer types, and film types. The 2300 Versys Star is available as an upgrade to existing 2300 Versys systems.