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TCP 9400DSiE
Category
Dry / Plasma EtchOverview
The TCP 9400DSiE is a deep silicon etch system designed for high-volume production. It offers broad process capability and flexibility for MEMS, advanced packaging, and power semiconductor applications. The system is based on Lam’s TCP 9400 Etch Series and features a patented TCP plasma source for uniform ion flux and high cross-wafer uniformity. Lam’s Waferless AutoClean technology maintains a consistent chamber environment for superior process stability. With over 1,300 chambers installed worldwide, the TCP 9400DSiE is a reliable choice for meeting the challenges of Si DRIE.
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