Overview

Exelan HPT is Lam’s latest dielectric etch system in the 200mm Alliance® wafer processing line. It offers trend-setting performance for all dielectric applications and processes developed on it can be easily transferred to the 2300 Exelan for 200mm wafers or scaled for 300mm processing. Exelan systems feature the industry’s largest dielectric etch portfolio and meet the challenges of new materials and reduced geometries with versatile Dual Frequency Confined™ (DFC™) plasma technology, Waferless Auto Cleans™ (WAC™), and an innovative narrow gap chamber design. Exelan provides innovative solutions for every dielectric etch application, including integrating multistep processes in new materials and offering a low-risk transition to larger substrates and diminishing geometries.