Overview

The Rainbow 4500 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow series includes the 4400, 4500, 4600, and 4700 for etching polysilicon, oxide, aluminum, and tungsten films respectively. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow series incorporates unique features that offer improved etch capability, reliability, and performance, including a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features are designed to enable semiconductor manufacturers to reduce wafer particle contamination to a level that exceeds industry standards and improve etch selectivity and uniformity while maintaining profile control and process flexibility.