Overview

The 4520XLE system has a wide process flexibility that allows fabs to develop processes for multiple dual damascene structures and investigate how well each can integrate into the interconnect process. Its broad process window provides this flexibility through independently controlled power settings that regulate charged particle flux and energy along with a wide operating pressure range. The system is able to run high pressure processes in situ, such as photoresist strip and nitride finish etch, eliminating extra wafer handling steps. This in situ process capability lowers overall costs per wafer.