We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. Read More
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The 4520XLE system has a wide process flexibility that allows fabs to develop processes for multiple dual damascene structures and investigate how well each can integrate into the interconnect process. Its broad process window provides this flexibility through independently controlled power settings that regulate charged particle flux and energy along with a wide operating pressure range. The system is able to run high pressure processes in situ, such as photoresist strip and nitride finish etch, eliminating extra wafer handling steps. This in situ process capability lowers overall costs per wafer.Documents
No documents
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
98804
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
RAINBOW 4520XLe
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
98804
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The 4520XLE system has a wide process flexibility that allows fabs to develop processes for multiple dual damascene structures and investigate how well each can integrate into the interconnect process. Its broad process window provides this flexibility through independently controlled power settings that regulate charged particle flux and energy along with a wide operating pressure range. The system is able to run high pressure processes in situ, such as photoresist strip and nitride finish etch, eliminating extra wafer handling steps. This in situ process capability lowers overall costs per wafer.Documents
No documents