SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components. 

Priming + Spin Coating + Spray Coating + Baking + Development
up to 200 mm 

SUSS MicroTec / KARL SUSS

GAMMA

KARL SUSS MA 200 is a Mask Aligners system. the SUSS MA 200 can be used with a 6”-8” wafer size.

MA200

MA 150 is a photolithographic machine equipped with a Hitachi monitor for Wafer alignment processing with size capability of 6” wafer and can be maximized up to 7”.

MA150

The KARL SUSS ACS 200 is a fully automatic coater/developer system for 200mm wafers. KARL SUSS ACS 200 include HVM and R&D in Advanced Packaging, MEMS and LED. Now on its 3rd generation, the KARL SUSS ACS 200 has the highest process module count of any 200 mm coater / developer on the market.

Automated equipment insures that all process steps are completed in a systematic, reproducible manner without variation inherent with manual operations. The Suss system may be configured with two or more coating systems, up to six hot plate units and an aqueous developer system. Substrates of many sizes, shapes may be processed simultaneously through any desired series of process steps or recipe.

ACS200

"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. 
 The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact).
 
 Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."

MJB3

The MA6 has upgraded optics designed to output in the mid-UV (250nm) range. The lamp is controlled by a CIC 100 constant intensity controller capable of delivering user-selectable UV doses which remain stable during the life of the lamp. Optical sensors monitor the UV output dose and provide feedback to the controller. There are 2 selectable channels. Both channels operate the lamp near its “idle power” (475W) to maximize lamp life. Because the lamp operates in constant intensity mode, the actual power will vary over time as the lamp ages.

The SUSS MA 200CC tools are automatic production mask aligners for making MCM-D substrates. They deliver excellent printing results with photo-BCB, a dielectric material used in MCMs. These aligners are suitable for designs as small as 5 microns and meet future photolithography needs in MCM-D technology. Their large depth of focus enables patterning on uneven surfaces.

MA200CC

MA56

SUSS MA8 mask alignment lithography machine is a lithography application solution developed for the R&D and trial production of 200mm IC back-end process. MA8 can fully meet the powerful functions and flexibility required by the laboratory. The compatibility of the exposure mode fully allows the process developed on the MA8 to be transplanted to the MA200 production mask alignment lithography machine of SUSS , and be applied in actual production.

MA8 can meet the needs of back-end processes, such as passivation and thin film bumping technology. Similarly, thick resist lithography and backside alignment capabilities make MA8 also have great application prospects in microsystem technology. In addition, MA8 is also considered as an ideal tool for communication and optoelectronic applications.

After adopting the low-diffraction exposure system, in addition to high-resolution standard lithography applications, the MA8 mask alignment lithography machine can also complete the following special technologies:

Bond alignment
near-field holographic lithography ,
UV processing
UV curing nanoimprinting, etc.

MA8/BA8

The KARL SUSS MA6/BA6 is a Mask Aligners system. The MA6/BA6 can be used with 6"/150mm wafer sizes.

MA6/BA6

Alignment + Exposure + UV Bonding
up to 200 mm 

MA200 COMPACT

Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation
Up to 200 mm 

CBC200

The SUSS PA200 Semiautomatic Probe System is available as two versions, one for high speed (HS) and one for high resolution (HR) applications. They are both very stable, modular and flexible probe systems for wafers and substrates up to 200 mm (8).

PA200

MA45

KARL SUSS MA 150E is a Mask Aligners system and it can be used with 2”-4” wafer size.

MA150E

Wafer Bonding + Bond Alignment + Cleaning +  Metal Oxide Removal + Plasma Activation
Up to 200 mm 

ABC200

200mm production mask aligner cassette-to-cassette with high throughput of up to 170 wafers/hour in first mask mode.

MA200E

The PA300 is an analytical prober conforming to EN 61010 - 1: 1993-04 which corresponds to UL 3101-1: 1993 and IEC 1010-1: 1992. By means of the PA300 electrical measurements on wafers and substrates up to a diameter of 300mm can be made. The only electrical connection to the measuring object is through the probecard, the probehead and the chuck.

PA300

PA200 HS 

RC8 MS3

"The KARL SUSS MA 150CC is a Mask Aligners system. the SUSS MA 150 can be used with 6” wafer size."
150mm production mask aligner cassette-to-cassette with high throughput of up to 170 wafers/hour in first mask mode.

MA150CC

ACS300

DARK BOX

Available as a completely automated system to level, align and package components down to 200 µm, the FC150 supports the complete range of bonding applications, including optoelectronics and MCM. The SUSS FC150 Bonder offers you the latest evolution in bonding technologies: ultrasonic/thermo-sonic, laser welding. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The FC150 can be equipped with tooling enabling all known bonding processes (i.e. Thermocompression, Adhesives, Reflow...) to perform wafer-to-wafer bonding, with round or square substrate sizes up to 100 mm diameter at +/- 1 µm post-bonding accuracy

FC-150

MA25

ELP300

The SB8e and the SB6e (SB8e/6e) represent the latest generation technology in substrate bonders offering precision performance and flexibility in a user-friendly, high-quality package. The newly designed and enhanced SB8e/6e are semi-automatic, computer-controlled systems with both vacuum- and pressurecontrolled atmosphere capability featuring an ergonomic load/ unload station. The SB8e/6e delivers superior post bond alignment accuracy resulting from precision mechanics, uniform force capability and leading temperature control. When matched with SUSS’ bond aligners, BA8/6, they offer enabling capability for MEMS, 3-D interconnects, and opto-electronics. This generation’s bond chamber and tooling supports all types of bond processes with optimization especially for thermocompression bonding and the flexibility to switch to anodic bond tooling. The flexibility of these bond systems make them ideal and economical for laboratories and small series production. Yet, combined with SUSS’ patent-pending low temperature plasma activation module these systems offer enabling technology for fusion bonding of SOI, III/V, and SiGe compounds at temperatures down to 200°C.

SB6e

CB200M

The KARL SUSS MA 8 is a Mask Aligners system. The KARL SUSS MA 8 can be used with a wafer size of 8”.
The SUSS laboratory mask aligners are machines designed for photolithography applications in laboratories and for small-scale production. The MA6 and MA8 machines only differ insignificantly in terms of operation.

MA8/BA8 Gen 3

"The ACS200Plus is a versatile spin coating and developing system designed for round wafers (2 inches to 200 mm) and square substrates (2 inches to 6 inches). It excels in various techniques like spin coating, spray coating, baking, and developing for applications including thin/thick adhesives and photosensitive polymers. It meets the demands of cutting-edge photoresist processes in optoelectronics, MEMS, and advanced packaging.

With its modular design, the ACS200Plus offers flexibility for R&D, trial production, and mass production. Configurable with 2, 4, or 6 process modules around a central manipulator, it allows for scalability by adding additional modular units.

The optional GYRSET module creates a uniform coating environment by minimizing disturbances and forming solvent-rich coatings. For a comprehensive lithography solution, the ACS200Plus can be combined with the MA200Compact mask alignment lithography machine to form the integrated LithoFab200 system."

ACS200 Plus

FC-250

The MA 1006 TSA, MA 1006 TSA/BSA and MA 1006 TSA/I R mask aligners are designed for high resolution photolithography in a laboratory, development, or pilot production environment. They offer unsurpassed flexibility in the handling of irregularly shaped substrates of differing thickness as well as standard size wafers up to 150mm diameter. All mask aligner of the MA 1006 series are partly motorised with a very easy-to-use user panel. The adjustment is done by micrometer screws. Both, screw and user panel are designed for best ergonomic position.  For most accurate alignment, each step of alignment can be viewed on a monitor using a splitfield microscope in combination with a CCD camera for bottom side alignment and a high resolution splitfield microscope for top side alignment. The MA 1006 is a compact mask aligner in a modular assembly design which allows a very easy maintenance procedure. The functional groups are easily accessible and the subassemblies can be quickly exchanged. 

MA1006

Semi-automated system up to 300 mm
Mechanical Debonding 

DB12T

260MS022

CT 62

GAMMA 80

With the DSM200, SUSS MicroTec has developed a new automated metrology system for all emerging front to backside alignment applications. The cassette-cassette front-to-back alignment metrology system is the ideal tool for verifying alignment accuracy on wafers from 2 inch to 200mm. Incorporating state-of-the-art pattern recognition technology, the DSM200 offers the highest measurement accuracy of 0.2 microns at 3 sigma on a fully automated platform with minimized operator intervention. Based on the latest production platform of the SUSS MA200Compact Mask Aligner, the DSM200 provides reliable and accurate metrology for double-sided alignment and exposure applications frequently used in the manufacturing of MEMS devices, power semiconductors and optoelectronics.

DSM200

MA 4/6

The Labcluster for Laboratories, Start-Ups, and Small Production
SUSS MicroTec’s Manual Coating System (MSC8) offers the latest generation of coating and aqueous developing techniques in a unique cluster configuration. It is designed and assembled to provide the greatest variety of functionalities on the smallest cleanroom footprint. Technologies which have proven themselves in SUSS MicroTec high-volume production tools are thus accessible to laboratories, start-ups, and small-scale production through the MCS8.

MCS8

KARL SUSS MA8/BA6 is capable of handling upto 200mm substrates and allows for pattern printing on both sides of the substrates. Applications for the Karl Suss MA8/BA6 include: MEMS; ACADEMIA and 3D STRUCTURING. The machinery is equiped with 3 alllignment modes- MEMS, ACADEMIA, 3D STRUCTURING.

MA8/BA6

MA 24

Alignment metrology for R&D and high-volume production.

DSM8 Gen2

DELTA 80T	

 Priming + Spin Coating + Puddle Development + Baking
up to 200mm

DELTA80

MA/BA8 Gen3

The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm.

FALCON

MJB 45S

SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.

SB6 Gen2 - from pieces up to 150mm wafers.

SB6 Gen2

Automated system up to 200 mm
Mask Alignment + Exposure

MA200 Gen3

RC8 THP

Voltage: 400 VAC / 50 Hz / 16 A
Compressed air: 5 - 6 bar / tube OD 8 mm
Vacuum: min. - 0.7 bar / tube OD 8 mm
Nitrogen: 4.5 bar / tube OD 8 mm
Exhaust: OD 100 mm (3x)

DELTA 80 T2

SB8e

SUSS MicroTec’s semi-automated wet-processing system SD12 offers superior cleaning and lift-off functions for solvent media applications. The single-wafer processing platform serves pieces, wafer sizes up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm. Its ability to handle various media and processes gives the flexibility needed for switching between applications and makes the tool first choice for research environment and small scale production.

SD12

RA 120

Easy to use and compact in size the SUSS MicroTec MJB4 represents the perfect system for laboratories and small volume production. As an inexpensive photolithography solution the MJB4 has set industry standards specifically for processing of small substrates and pieces up to 100 mm. Equipped with a reliable, high precision mask alignment and high resolution printing capability in the submicron range the MJB4 demonstrates a performance unsurpassed by any comparable machine

MJB4

Manual Spray Coater for High Topographies
SUSS MicroTec AS8/AS12 is the ideal tool for R&D and low-volume fabrication. Substrates up to 200 mm or 300 mm in diameter and square substrates up to 6" edge length can be processed. The system can be equipped with up to two separate spray dispense systems. The sophisticated resist supply system offers unmatched process stability and reproducibility. All spray and cleaning parameters can be programmed in the recipe.
The manual product line of SUSS MicroTec coaters offers easy recipe transfer to automated platforms.

SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.

SB8 Gen2 - from pieces up to 200mm wafers.

SB8 Gen2

DELTA 20T

Dedicated Mask Aligner Solution for High Volume Production of Compound Semiconductors Devices
With the MA100/150e Gen2 SUSS MicroTec has designed a dedicated mask aligner platform for processing high brightness LEDs (HB-LED) on substrates up to 150 mm. With its high precision mask alignment, sophisticated substrate handling for fragile, warped and transparent wafers and its high resolution down to 0.7 µm the MA100/150e Gen2 is able to overcome all lithography challenges given by the LED manufacturing process. Lowest cost of ownership is achieved by superior throughput performance.

MA100/150e Gen2

The BA8 Gen4 Pro bond alignment platform is designed for demanding processes in MEMS and LED production and advanced packaging markets. It accurately aligns substrates and secures their position in fixtures for further process steps. The bond alignment of two wafers is based on the same powerful technology that has proven its value with SUSS MicroTec’s mask aligners for mask to wafer alignment. The platform can be configured as a bond aligner only or as a combination of mask and bond aligner. A direct bonding toolkit offers  extra functionality for pre-bonding substrates. In order to enhance direct bonding processes, the BA8 Gen4 Pro can be equipped with an optional toolkit for selective and full-wafer surface activation. It can easily be upgraded with additional functions within a short time. The system handles substrates up to 200 mm in size. With its ergonomic  operation and intuitive user interface, the BA8 Gen4 Pro is easy to work with and requires only minimal operator training. Its high  degree of automation allows for easy operation and an application in labs, research and development as well as small series production.

BA8 Gen4 Pro

Laboratory Spin Coat and Develop Solution for Wafers up to 150 and 200mm
SUSS MicroTec‘s LabSpin platform represents the next generation of manual spin coater and developer systems that have been developed specifically for laboratory and R&D. Designed for a variety of photolithography chemicals, LabSpin systems provide uniform, precise and repeatable spin coating results on the wafer through its advanced process chamber design.

LABSPIN6

Coating + Developing + Alignment + Exposure
up to 300 mm 
Used for the Advanced Packaging of 300-mm wafers. 

LithoPack300

 The DSC300 Gen3 Scanner delivers 300 mm wafer throughput of > 90 wph at 400 mJ/cm2 and > 80 wph at 1000 mJ/cm2.

DSC300 Gen3

The fully automated SUSS DSM200 also features a robotic substrate handling system. In addition, customized handling options are available, including unique measurement chucks. Optional IR illumination enables through-silicon measurement capability.

 DSM200 Gen2

MA21

Flexible Solution for Aqueous Development and Cleaning
SUSS MicroTec’s semi-automated wet-processing system AD12 offers superior cleaning and developing functions for aqueous media applications. The single-wafer processing platform serves pieces, wafer sizes up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm. Its ability to handle various media and processes gives the flexibility needed for switching between applications and makes the tool first choice for research environment and small scale production.

AD12

The vapor primer prepares the wafer surface to improve the surface condition for optimal resist adhesion.
Manual system up to 200 mm.

It is a high force bonder, from 10 gram-force up to 400 kilogram-force depending on the head configuration. This device bonder can operate as a "classic" one but also with a confinement chamber, using an acid gas mixture and/or reduced pressure. This permits much better quality of bonding process, resulting in good electrical conductivity and high mechanical resistance for more reliable components. Substrate size can be up to 300mm wafer.

FC-300

PH150

The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high-throughput and modular photolithography processing for 200 and 300mm wafers. Both wafer sizes can be processed parallel or sequential without any mechanical changeover. SUSS MicroTec ACS300 Gen2 systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based developing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide, PBO and Cyclotene (BCB).

SUSS MicroTec ACS300 Gen2 addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.

ACS300 Gen2

MA/BA6

DELTA ALTASPRAY

Operator-Assisted Mask Aligner for Industrial Research and Cost-Effective Production
Based on the latest mask aligner technology, the MA12 is designed for operator-assisted alignment and exposure of wafers up to 300mm and square substrates and is suitable for industrial research and production. With its flexible handling and process control features the MA12 is the right tool of choice for advanced packaging applications like 3D wafer-level chip scale packaging as well as for the production and development of sensitive devices such as MEMS.

MA12

The SUSS PM5  is the most cost-effective and simple, yet highly precise, probing solution for wafers and substrates up to 150 mm. Great application flexibility is ensured for DC and HF measurements, device and wafer characterization tests (DWC), failure analysis (FA), submicron probing, MEMS and opto engineering tests. It can also be used as a flexible probe card for special wafer level reliability (WLR) applications, allowing up to 20 SUSS ProbeHeadsTM at one time to be placed on the stable platen. 

The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.

ACS200 Gen3

MA16

PH120

Substrates: 
100mm - 300mm (round)
5inch - 14inch (square) others on request

HMx SQUARE 14

MA150M

The LD12 debond module supplements the SUSS MicroTec product portfolio for laser-based wafer processing. It is based on the application of an excimer laser which uses nanosecond, high energy 308 nm laser pulses to break the chemical bonds in a release layer or the actual adhesive which holds the glass carrier to the device wafer. This excimer laser based debonding process does not produce significant thermal stress and therefore ensures the integrity of sensitive components. The LD12 module is designed to debond glass carriers from full thickness wafers or thinned 200 mm and 300mm wafers which are mounted on tape frames.
Using the LD12 enables high throughput debonding for applications in 2.5D and 3D integration, 3D MEMS and CIS, as well as in the field of power devices to be carried out quickly and carefully.

LD12

**PARTS**

Automated system up to 300 mm (Excimer Laser) 
Alignment + Ablation + Laser-Assisted  Debonding + Laser Seed Layer  Removal

ELP300 Gen2

LabSpin8 is suitable for round substrates up to 200 mm diameter or square substrates up to 150x150 mm. With a wide range of substrate holders, even fragments and special shapes can be processed without any problems.

LABSPIN8

MA150RH

MA100G

The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.

MA300 Plus

MA/BA6 Gen3

The KARL SUSS MA 150EL is a Mask Aligners system. The MA 150EL can be used with Wafer Size of 6”.

MA150EL

MA300

MA55

XBC300

AS12

The Karl Suss BA 6 mask aligner can be used for processing of wafers from 2" to 150mm. The Karl Suss BA 6 is designed for all standard lithography applications and wafer sized up to 150mm. The Karl Suss BA 6 also offers high resolution and optimum edge quality for thick-resist MEMs applications, and features tailored to III-V compounds, thin or warped wafers, tranparent substrates, or single dies.

SUSS MicroTec / KARL SUSS

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