Overview

Highly Automated Mask Aligner Platform for 300 mm and 200 mm Wafers SUSS MicroTec's MA300 Gen2 is a highly automated mask alignment platform for 300 mm and 200 mm wafers. It is specifically designed for 3D Packaging, wafer level packaging and flip-chip applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed. The MA300 Gen2 represents a new generation of mask aligners from SUSS MicroTec that are designed to address the requirements of modern high-end fabs in a high volume manufacturing environment.