SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components. 

SUSS MicroTec / KARL SUSS

MA150RH

MA21

Operator-Assisted Mask Aligner for Industrial Research and Cost-Effective Production
Based on the latest mask aligner technology, the MA12 is designed for operator-assisted alignment and exposure of wafers up to 300mm and square substrates and is suitable for industrial research and production. With its flexible handling and process control features the MA12 is the right tool of choice for advanced packaging applications like 3D wafer-level chip scale packaging as well as for the production and development of sensitive devices such as MEMS.

MA12

Highly Automated Mask Aligner Platform for 300 mm and 200 mm Wafers
SUSS MicroTec's MA300 Gen2 is a highly automated mask alignment platform for 300 mm and 200 mm wafers. It is specifically designed for 3D Packaging, wafer level packaging and flip-chip applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed. The MA300 Gen2 represents a new generation of mask aligners from SUSS MicroTec that are designed to address the requirements of modern high-end fabs in a high volume manufacturing environment.

MA300 Gen2

The MA/BA Gen4 series is the entry-level model, available as MA/BA6 Gen4 and MA/BA8 Gen4. With its enhanced ergonomic and user-friendly design, cost efficiency and reduced footprint, it is the perfect tool for use in research and low volume production.

MA/BA6 Gen4

MA100

KARL SUSS MA8/BA6 is capable of handling upto 200mm substrates and allows for pattern printing on both sides of the substrates. Applications for the Karl Suss MA8/BA6 include: MEMS; ACADEMIA and 3D STRUCTURING. The machinery is equiped with 3 alllignment modes- MEMS, ACADEMIA, 3D STRUCTURING.

MA8/BA6

MA55

The KARL SUSS MA 100E is a Mask Aligners system. the KARL SUSS MA 100E can be used up to 6” wafer sizes.


MA100E

MA26

MA150ML

Dedicated Mask Aligner Solution for High Volume Production of Compound Semiconductors Devices
With the MA100/150e Gen2 SUSS MicroTec has designed a dedicated mask aligner platform for processing high brightness LEDs (HB-LED) on substrates up to 150 mm. With its high precision mask alignment, sophisticated substrate handling for fragile, warped and transparent wafers and its high resolution down to 0.7 µm the MA100/150e Gen2 is able to overcome all lithography challenges given by the LED manufacturing process. Lowest cost of ownership is achieved by superior throughput performance.

MA100/150e Gen2

MA150RSH

MA100G

260MS143-02

MA4 SERIES III

This mask aligner provides high resolution photolithography and can process samples in a variety of shapes and sizes. The KARL SUSS MJB 3 UV400 processes wafers up to 3” in diameter and its resolution can reach 1-2 microns. Configuration includes 350W mercury short-arc lamp, high precision stage with alignment accuracy up to 0.25 microns, high resolution contact exposure mode, high precision alignment with microscope manipulator, and special substrate chucks for irregular materials, thick substrates, and hybrids.

MJB3 UV400

MA300

MA/BA6 Gen3

MA12 Gen3

MJB21

MJB55

MA300 Gen3

MA/BA8 Gen4

The Karl Suss BA 6 bond aligner can be used for processing of wafers from 2" to 150mm. The Karl Suss BA 6 is designed for all standard lithography applications and wafer sized up to 150mm. The Karl Suss BA 6 also offers high resolution and optimum edge quality for thick-resist MEMs applications, and features tailored to III-V compounds, thin or warped wafers, tranparent substrates, or single dies.

Mask/Bond Aligner 

The SUSS SB6L is the ideal complement to the SUSS Bond Aligner. It is a universal tool for wafer bonding processes for micro electro-mechanical system applications such as: Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding (AB) (SFB), Thermal Compression Bonding (TCB) (ADB) After alignment on the Bond Aligner, the substrate stacks are mechanically clamped using the transport fixture for further processing in the Substrate Bonder. 

SB6L

MA/BA6

MA16

SUSS MicroTec’s MA8 Gen5 is setting a new benchmark in full-field lithography for MEMS & NEMS, 3D integration and compound semiconductor markets, especially for a large variety of imprint applications in the field of LED, MEMS/NEMS, micro-optics, augmented reality and opto-electronic sensors using the renowned SMILE technology. It is also able to handle processes such as bond alignment and fusion bonding.

MA8 Gen5

MA14

The KARL SUSS MA 150EL is a Mask Aligners system. The MA 150EL can be used with Wafer Size of 6”.

MA150EL

The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.

MA300 Plus

The MA/BA Gen4 series is the entry-level model, available as MA/BA6 Gen4 and MA/BA8 Gen4. With its enhanced ergonomic and user-friendly design, cost efficiency and reduced footprint, it is the perfect tool for use in research and lowvolume production.

MA/BA8 Gen4 Pro

KARL SUSS MA200 mask aligner is suited for automated processing of square substrates and wafers up to 200 mm.

MA200EL

MA150M

MA 150 is a photolithographic machine equipped with a Hitachi monitor for Wafer alignment processing with size capability of 6” wafer and can be maximized up to 7”.

MA150

KARL SUSS MA 200 is a Mask Aligners system. the SUSS MA 200 can be used with a 6”-8” wafer size.

MA200

"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. 
 The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact).
 
 Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."

MJB3

The MA6 has upgraded optics designed to output in the mid-UV (250nm) range. The lamp is controlled by a CIC 100 constant intensity controller capable of delivering user-selectable UV doses which remain stable during the life of the lamp. Optical sensors monitor the UV output dose and provide feedback to the controller. There are 2 selectable channels. Both channels operate the lamp near its “idle power” (475W) to maximize lamp life. Because the lamp operates in constant intensity mode, the actual power will vary over time as the lamp ages.

KARL SUSS MA 150E is a Mask Aligners system and it can be used with 2”-4” wafer size.

MA150E

MA56

200mm production mask aligner cassette-to-cassette with high throughput of up to 170 wafers/hour in first mask mode.

MA200E

Alignment + Exposure + UV Bonding
up to 200 mm 

MA200 COMPACT

MA8/BA8 Gen 3

The KARL SUSS MA6/BA6 is a Mask Aligners system. The MA6/BA6 can be used with 6"/150mm wafer sizes.

MA6/BA6

"The KARL SUSS MA 150CC is a Mask Aligners system. the SUSS MA 150 can be used with 6” wafer size."
150mm production mask aligner cassette-to-cassette with high throughput of up to 170 wafers/hour in first mask mode.

MA150CC

MA/BA8 Gen3

MA 24

MA25

SUSS MA8 mask alignment lithography machine is a lithography application solution developed for the R&D and trial production of 200mm IC back-end process. MA8 can fully meet the powerful functions and flexibility required by the laboratory. The compatibility of the exposure mode fully allows the process developed on the MA8 to be transplanted to the MA200 production mask alignment lithography machine of SUSS , and be applied in actual production.

MA8 can meet the needs of back-end processes, such as passivation and thin film bumping technology. Similarly, thick resist lithography and backside alignment capabilities make MA8 also have great application prospects in microsystem technology. In addition, MA8 is also considered as an ideal tool for communication and optoelectronic applications.

After adopting the low-diffraction exposure system, in addition to high-resolution standard lithography applications, the MA8 mask alignment lithography machine can also complete the following special technologies:

Bond alignment
near-field holographic lithography ,
UV processing
UV curing nanoimprinting, etc.

MA8/BA8

The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm.

Wafer Bonder

MA45

Automated system up to 200 mm
Mask Alignment + Exposure

MA200 Gen3

Alignment metrology for R&D and high-volume production.

DSM8 Gen2

The MA 1006 TSA, MA 1006 TSA/BSA and MA 1006 TSA/I R mask aligners are designed for high resolution photolithography in a laboratory, development, or pilot production environment. They offer unsurpassed flexibility in the handling of irregularly shaped substrates of differing thickness as well as standard size wafers up to 150mm diameter. All mask aligner of the MA 1006 series are partly motorised with a very easy-to-use user panel. The adjustment is done by micrometer screws. Both, screw and user panel are designed for best ergonomic position.  For most accurate alignment, each step of alignment can be viewed on a monitor using a splitfield microscope in combination with a CCD camera for bottom side alignment and a high resolution splitfield microscope for top side alignment. The MA 1006 is a compact mask aligner in a modular assembly design which allows a very easy maintenance procedure. The functional groups are easily accessible and the subassemblies can be quickly exchanged. 

MA1006

The SUSS MA 200CC tools are automatic production mask aligners for making MCM-D substrates. They deliver excellent printing results with photo-BCB, a dielectric material used in MCMs. These aligners are suitable for designs as small as 5 microns and meet future photolithography needs in MCM-D technology. Their large depth of focus enables patterning on uneven surfaces.

MA200CC

The KARL SUSS MA 8 is a Mask Aligners system. The KARL SUSS MA 8 can be used with a wafer size of 8”.
The SUSS laboratory mask aligners are machines designed for photolithography applications in laboratories and for small-scale production. The MA6 and MA8 machines only differ insignificantly in terms of operation.

MJB 45S

260MS022

MA 4/6

Easy to use and compact in size the SUSS MicroTec MJB4 represents the perfect system for laboratories and small volume production. As an inexpensive photolithography solution the MJB4 has set industry standards specifically for processing of small substrates and pieces up to 100 mm. Equipped with a reliable, high precision mask alignment and high resolution printing capability in the submicron range the MJB4 demonstrates a performance unsurpassed by any comparable machine

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

SUSS MicroTec / KARL SUSS

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Top SUSS MicroTec / KARL SUSS Mask/Bond Aligners

MA8/BA6

MA12

MA300 Gen2

MA100/150e Gen2

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All SUSS MicroTec / KARL SUSS Mask/Bond Aligners