Overview

The SUSS SB6L is the ideal complement to the SUSS Bond Aligner. It is a universal tool for wafer bonding processes for micro electro-mechanical system applications such as: Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding (AB) (SFB), Thermal Compression Bonding (TCB) (ADB) After alignment on the Bond Aligner, the substrate stacks are mechanically clamped using the transport fixture for further processing in the Substrate Bonder.