The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.

SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components. 

ACS200 Gen3

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