Description
LithoConfiguration
-COATER CUP – 2X -DEVELOPER CUPS – 2X -Running condition Model: 200AA129 - Genmark Gencobot 8/3L Handler - Thermo Scientific A40 Chiller with PC 200 Immersion Circulator - Module 1: Spinner Module - Module 2: Filler Module - Module 3: HCV Module - Module 4: Spinner ModuleOEM Model Description
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.Documents
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SUSS MicroTec / KARL SUSS
ACS200 Gen3
Verified
CATEGORY
Coaters & Developers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Idle
Product ID:
111541
Wafer Sizes:
Unknown
Vintage:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SUSS MicroTec / KARL SUSS
ACS200 Gen3
CATEGORY
Coaters & Developers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Idle
Product ID:
111541
Wafer Sizes:
Unknown
Vintage:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
LithoConfiguration
-COATER CUP – 2X -DEVELOPER CUPS – 2X -Running condition Model: 200AA129 - Genmark Gencobot 8/3L Handler - Thermo Scientific A40 Chiller with PC 200 Immersion Circulator - Module 1: Spinner Module - Module 2: Filler Module - Module 3: HCV Module - Module 4: Spinner ModuleOEM Model Description
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.Documents
No documents