Description
No descriptionConfiguration
Electric Power: Voltage: 400V 3-phase + N + PE Power: 16 kVA Frequency: 50 Hz AIC: 100 kA / 400 VAC FLC: 23 A SCCR: 5 kA Max. Single Load: 5.5 A Pneumatic Connections: CDA (Air): 6 bar ±10% Nitrogen (N₂): 6 bar ±10% Vacuum (VAC): -0.8 bar ±0.1% DIW (Deionized Water): — bar Compliance: CE MarkedOEM Model Description
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.Documents
No documents
CATEGORY
Coaters & Developers
Last Verified: 18 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
137018
Wafer Sizes:
Unknown
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SUSS MicroTec / KARL SUSS
ACS200 Gen3
CATEGORY
Coaters & Developers
Last Verified: 18 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
137018
Wafer Sizes:
Unknown
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Electric Power: Voltage: 400V 3-phase + N + PE Power: 16 kVA Frequency: 50 Hz AIC: 100 kA / 400 VAC FLC: 23 A SCCR: 5 kA Max. Single Load: 5.5 A Pneumatic Connections: CDA (Air): 6 bar ±10% Nitrogen (N₂): 6 bar ±10% Vacuum (VAC): -0.8 bar ±0.1% DIW (Deionized Water): — bar Compliance: CE MarkedOEM Model Description
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.Documents
No documents