
Description
No descriptionConfiguration
- # of HMDS chamber (VPO): 1 - # of hotplates: 8 - # of chill plates: 2 - # of coaters: 2 - # of develop bowl: 2 - # of resist lines each bowl: 3 - # of develop line each bowl: 2:DEV (binary , fan spray), 2: DI (binary, fan spray), 1:N2 - # of CPD, for small sample dispense and coating: 2 - Configured for 200mm Wafers, but is 150mm capable - Vintage: 2022 - As Is, Where Is, Ex-work - HDD is included. - End user is responsible for flushing, system module deinstallation, rigging, and crating. Flushing Process: - Use PGMEA to purge the chemicals out. - Then Acetone and/or PGMEA soak the line for 1-2 days. - Then Acetone or PGmEA to purge and empty the line and dry.OEM Model Description
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.Documents
No documents
CATEGORY
Coaters & Developers
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
150817
Wafer Sizes:
8"/200mm
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllSUSS MicroTec / KARL SUSS
ACS200 Gen3
CATEGORY
Coaters & Developers
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
150817
Wafer Sizes:
8"/200mm
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
- # of HMDS chamber (VPO): 1 - # of hotplates: 8 - # of chill plates: 2 - # of coaters: 2 - # of develop bowl: 2 - # of resist lines each bowl: 3 - # of develop line each bowl: 2:DEV (binary , fan spray), 2: DI (binary, fan spray), 1:N2 - # of CPD, for small sample dispense and coating: 2 - Configured for 200mm Wafers, but is 150mm capable - Vintage: 2022 - As Is, Where Is, Ex-work - HDD is included. - End user is responsible for flushing, system module deinstallation, rigging, and crating. Flushing Process: - Use PGMEA to purge the chemicals out. - Then Acetone and/or PGMEA soak the line for 1-2 days. - Then Acetone or PGmEA to purge and empty the line and dry.OEM Model Description
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.Documents
No documents